Abstract
With the development of new generation 5G communication technology, the demands for the ceramic/polymer dielectric composites with ultra-low dielectric constant and low coefficient of thermal expansion become imperative. In order to reduce the dielectric constant of the composites, the air with the lowest dielectric constant is introduced into the composites. In this study, the hollow silica microspheres (HSM) used as the fillers are introduced in polytetrafluoroethylene (PTFE) matrix to fabricate HSM/PTFE composites, and the effect of HSM on the structure, dielectric properties, and thermal properties of the composites have been investigated. The dielectric constant and CTE of the composites gradually decrease as the fillers increases, and HSM/PTFE composites with filler content of 40 vol% exhibit the excellent properties (ε ≈ 1.94,, tanδ ≈ 0.83 × 10−3) at high frequency (≥ 10 GHz) and lower coefficient of thermal expansion (CTE ≈ 95 ppm/°C).
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Acknowledgements
This work was supported by the National Natural Science Foundation of China (Grant No. 51572205), the Foundation Strengthening Program Key Basic Research Project (Grant No. 2019-JCJQZD-291).
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Funding was provided by the National Natural Science Foundation of China (Grant No. 51572205) and the Foundation Strengthening Program Key Basic Research Project (Grant No. 2019-JCJQZD-291).
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YL has done the fabrication of the composites and the writing of the manuscript. JZ, JS, and QL have been involved in characterizations and compiling of the manuscript. YQ and WC have helped in experiments and improving the overall quality of the manuscript.
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Li, Y., Zhou, J., Shen, J. et al. Ultra-low permittivity HSM/PTFE composites for high-frequency microwave circuit application. J Mater Sci: Mater Electron 33, 10096–10103 (2022). https://doi.org/10.1007/s10854-022-07999-z
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DOI: https://doi.org/10.1007/s10854-022-07999-z