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Pressure-assisted soldering of copper using porous metal-reinforced Sn58Bi solder

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Abstract

In this study, porous metals (Ni, Cu) with the porosity of 110 and 500 ppi were, respectively, added into the SnBi solder joint to obtain the SnBi@P–Cu and SnBi@P–Ni composite solder joints. To ensure the bonding quality between the solder layers and the Cu substrates, a low pressure of 0.1 MPa was conducted during the soldering process. The microstructure and shear behavior of the composite solder joints were investigated. With the addition of 110 ppi porous metals, the microstructures of the solder joints are mainly composed of porous metals and SnBi solder matrix. As the porosity of P–Cu and P–Ni metals increases to 500 ppi, the concentration of the SnBi matrix decreases sharply in the solder joints. The cross-sectional microstructures of the solder joints present a uniform morphology of P-metals and intermetallic compound (IMC). Here the IMC is Cu6Sn5 in the SnBi@P–Cu joint, but (Ni, Cu)3Sn4 and (Cu, Ni)6Sn5 in the SnBi@P–Ni joint. The shear strength of the SnBi solder joint increases significantly with the addition of porous metals. The average shear strength of SnBi@110P–Cu reaches 85.28 MPa, which is the highest among the investigated solder joints.

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Authors and Affiliations

  1. College of Electrical, Energy and Power Engineering, Yangzhou University, Yangzhou, 225009, People’s Republic of China

    Yang Liu, Boqiao Ren, Yuxiong Xue, Min Zhou, Rongxing Cao, Penghui Chen & Xianghua Zeng

  2. School of Material Science and Engineering, Harbin University of Science and Technology, Harbin, People’s Republic of China

    Boqiao Ren

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  1. Yang Liu
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  2. Boqiao Ren
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  3. Yuxiong Xue
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  4. Min Zhou
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  6. Penghui Chen
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  7. Xianghua Zeng
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Correspondence to Yuxiong Xue.

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Liu, Y., Ren, B., Xue, Y. et al. Pressure-assisted soldering of copper using porous metal-reinforced Sn58Bi solder. J Mater Sci: Mater Electron 32, 18968–18977 (2021). https://doi.org/10.1007/s10854-021-06412-5

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  • DOI: https://doi.org/10.1007/s10854-021-06412-5

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