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Effect of adding nanometric ZnO particles on thermal, microstructure and tensile creep properties of Sn–6.5 wt%Zn–3 wt%In solder alloy

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Abstract

Mechanical properties of solders benefit from uniform dispersion of fine precipitates and small effective grain sizes. Metallurgical methods of attaining such a beneficial microstructure have been investigated in the plain Sn–6.5 wt%Zn–3 wt%In (plain) solder and Sn–6.5 wt%Zn–3 wt%In–0.3 wt%ZnO (composite) solder. It has been found that a small alloying addition of ZnO nano particles has a beneficial effect on the microstructure. It improves the tensile creep properties of the composite solder alloy. The improvement is attributed to uniform distribution and refining of the β-Sn dendrites and the effective refined grain size in the solidified microstructure. Thereby the composite solder has better mechanical properties than the plain solder alloy.

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Authors and Affiliations

  1. Physics Department, Faculty of Science, Ain Shams University, Cairo, Egypt

    G. S. Al-Ganainy & A. Fawzy

  2. Physics Department, Faculty of Science, Zagazig University, Zagazig, Egypt

    A. A. El-Daly

  3. Basic Science Department, Modern Academy For Science and Technology, Cairo, Egypt

    N. Hussein

Authors
  1. G. S. Al-Ganainy
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  2. A. A. El-Daly
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  3. A. Fawzy
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  4. N. Hussein
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Corresponding author

Correspondence to A. Fawzy.

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Al-Ganainy, G.S., El-Daly, A.A., Fawzy, A. et al. Effect of adding nanometric ZnO particles on thermal, microstructure and tensile creep properties of Sn–6.5 wt%Zn–3 wt%In solder alloy. J Mater Sci: Mater Electron 28, 13303–13312 (2017). https://doi.org/10.1007/s10854-017-7166-1

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  • DOI: https://doi.org/10.1007/s10854-017-7166-1

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