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Influence of SnO2 Nanoparticles Addition on Microstructure, Thermal Analysis, and Interfacial IMC Growth of Sn1.0Ag0.7Cu Solder

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Abstract

A new lead-free Sn-1.0Ag-0.7Cu-xSnO2 composite solder was smelted in a vacuum arc furnace at 900°C for 30 min. This paper investigated the influence of SnO2 nanoparticles on the microstructure, melting properties and growth of interfacial intermetallic compounds (IMCs) at the interface between Cu and the composite solder during isothermal aging. The results indicated that SnO2 particles effectively refined the β-Sn grains and reduced the size of Cu6Sn5. The thermal analysis data showed that nano-sized SnO2 decreased the pasty range and melting temperature. In addition, the additional nanoparticles reduced the diffusion coefficient and impeded the growth of intermetallic compounds during soldering and aging. The effect of nanoparticles on solder is closely associated with the added amount of nano-SnO2 particles. When the SnO2 concentration was 1.0 wt.%, the composite solder possessed an excellent microstructure, suitable melting properties and obvious inhibition effect on the interfacial IMCs. However, excessive addition of SnO2 particles in the solder alloys decreased the inhibition effect of the interfacial IMCs.

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References

  1. M.M. Billah, K.M. Shorowordi, and A. Sharif, J. Alloys Comp. 585, 32 (2014).

    Article  Google Scholar 

  2. I. Anderson, J. Mater. Sci. Mater. Electron. 18, 55 (2007).

    Article  Google Scholar 

  3. K.S. Kim, S.H. Huh, and K. Suganuma, J Alloys Compd. 352, 226 (2003).

    Article  Google Scholar 

  4. H. Hao, Y.W. Shi, Z.D. Xia, Y.P. Lei, and F. Gao, J. Electron. Mater. 37, 2 (2008).

    Article  Google Scholar 

  5. L. Zhang, X.Y. Fan, Y.H. Guo, and C.W. He, Mater. Des. 57, 646 (2014).

    Article  Google Scholar 

  6. G.Y. Li, X.D. Bi, Q. Chen, and X.Q. Shi, J. Electron. Mater. 40, 165 (2011).

    Article  Google Scholar 

  7. S.Y. Chang, C.C. Jain, T.H. Chuang, L.P. Feng, and L.C. Tsao, Mater. Des. 32, 4720 (2011).

    Article  Google Scholar 

  8. Y.S. Lai, P.F. Yang, and C.L. Yeh, Microelectron. Reliab. 46, 645 (2006).

    Article  Google Scholar 

  9. D.A.A. Shnawah, S.B.M. Said, M.F.M. Sabri, I.A. Bradruddin, and F.X. Che, Microelectron. Reliab. 52, 2701 (2012).

    Article  Google Scholar 

  10. J.E. Spinelli and A. Garcia, J. Mater. Sci. Mater. Electron. 25, 478 (2014).

    Article  Google Scholar 

  11. J.H. Lee, A.M. Yu, J.H. Kim, M.S. Kim, and N. Kang, Met. Mater. Int. 14, 649 (2008).

    Article  Google Scholar 

  12. G. Zeng, S.D. McDonald, Q. Gu, Y. Terada, K. Uesugi, H. Yasuda, and K. Nogita, Acta Mater. 83, 357 (2015).

    Article  Google Scholar 

  13. T. Ishizaki, M. Usui, and Y. Yamada, Microelectron. Reliab. 55, 1861 (2015).

    Article  Google Scholar 

  14. A.A. El-Daly, W.M. Desoky, T.A. Elmosalami, M.G. El-Shaarawy, and A.M. Abdraboh, Mater. Des. 65, 1196 (2015).

    Article  Google Scholar 

  15. J. Shen, Y.C. Liu, Y.J. Han, Y.M. Tian, and H.X. Gao, J. Electron. Mater. 35, 1672 (2006).

    Article  Google Scholar 

  16. A.K. Gain, Y.C. Chan, Microelectron. Reliab. 54, 945 (2014).

    Article  Google Scholar 

  17. Y. Tang, G.Y. Li, and Y.C. Pan, Mater. Des. 55, 574 (2014).

    Article  Google Scholar 

  18. Y. Gu, X. Zhao, Y. Li, Y. Liu, Y. Wang, and Z. Li, J. Alloys Compd. 627, 39 (2015).

    Article  Google Scholar 

  19. L. Zhang and L.L. Gao, J. Alloys Compd. 635, 55 (2015).

    Article  Google Scholar 

  20. P. Babaghorbani, S.M.L. Nai, and M. Gupta, J. Mater. Sci. Mater. Electron. 20, 571 (2009).

    Article  Google Scholar 

  21. A.A. El-Daly, T.A. Elmosalami, W.M. Desoky, M.G. El-Shaarawy, and A.M. Abdraboh, Mater. Sci. Eng. A 618, 389 (2014).

    Article  Google Scholar 

  22. L.C. Tsao, S.Y. Chang, C.I. Lee, W.H. Sun, and C.H. Huang, Mater. Des. 31, 4831 (2010).

    Article  Google Scholar 

  23. A.K. Gain, Y.C. Chan, and W.K.C. Yung, Microelectron. Reliab. 51, 975 (2011).

    Article  Google Scholar 

  24. J. Shen and Y.C. Chen, J. Alloys Compd. 477, 552 (2009).

    Article  Google Scholar 

  25. X. Zhao, Y. Wen, Y. Li, Y. Liu, and Y. Wang, J. Alloys Compd. 662, 272 (2016).

    Article  Google Scholar 

  26. X.D. Liu, Y.D. Han, H.Y. Jing, J. Wei, and L.Y. Xu, Mater. Sci. Eng. A 562, 25 (2013).

    Article  Google Scholar 

  27. L.C. Tsao, Mater. Sci. Eng. A 529, 41 (2011).

    Article  Google Scholar 

  28. Y. Huang, Z. Xiu, G. Wu, Y. Tian, P. He, and X. Gu, Mate. Lett. 169, 262 (2016).

    Article  Google Scholar 

  29. A.A. El-Daly, A.E. Hammad, G.S. Al-Ganainy, and M. Ragab, Mater. Sci. Eng. A 608, 130 (2014).

    Article  Google Scholar 

  30. S. Chellvarajoo and M.Z. Abdullah, Mater. Des. 90, 499 (2016).

    Article  Google Scholar 

  31. P.L. Tu, Y.C. Chan, K.C. Hung, and J.K.L. Lai, Scripta Mater. 44, 371 (2001).

    Article  Google Scholar 

  32. L.C. Tsao, J. Alloys Compd. 509, 8441 (2011).

    Article  Google Scholar 

  33. R.W. Wu, L.C. Tsao, and R.S. Chen, J. Mater. Sci. Mater. Electron. 26, 1858 (2015).

    Article  Google Scholar 

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Authors and Affiliations

  1. School of Material Science and Engineering, China University of Mining and Technology, Xuzhou, 221116, China

    Ren Sun, Yanwei Sui, Jiqiu Qi, Fuxiang Wei, Yezeng He, Xiao Chen, Qingkun Meng & Zhi Sun

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  1. Ren Sun
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  2. Yanwei Sui
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  3. Jiqiu Qi
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  4. Fuxiang Wei
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  5. Yezeng He
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  6. Xiao Chen
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  7. Qingkun Meng
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  8. Zhi Sun
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Correspondence to Yanwei Sui.

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Sun, R., Sui, Y., Qi, J. et al. Influence of SnO2 Nanoparticles Addition on Microstructure, Thermal Analysis, and Interfacial IMC Growth of Sn1.0Ag0.7Cu Solder. J. Electron. Mater. 46, 4197–4205 (2017). https://doi.org/10.1007/s11664-017-5374-3

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  • DOI: https://doi.org/10.1007/s11664-017-5374-3

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