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Structural and electrical properties of fritless Ni(1−x)Cu x Mn2O4 (0 ≤ x ≤ 1) thick film NTC ceramic

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Abstract

Spinel structured NTC thermistor Ni(1−x)Cu x Mn2O4 (0 ≤ x ≤ 1) ceramics was prepared by oxalic precursor method and fritless thick films screen printed on alumina. The composition dependent structural and electrical properties are reported in this paper. The results show that with increasing copper ion substitution both Cu2+ and Mn4+ predominantly occupy the octahedral site. The concentration of Cu2+ ions in octahedral site increases while that of Ni2+ ions decreases linearly. The thick film Ni(1−x)Cu x Mn2O4 ceramic comply with Arrhenius equation. A thermistor constant of ~1,200 K has been obtained for fritless thick film NTC ceramics using inorganic binders in the RT/90 thermal range.

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Acknowledgments

One of the authors Vijaya Puri gratefully acknowledges the UGC India for Award of Research Scientist ‘B’. The authors also acknowledge UGC DRS-SAP II funding.

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Authors and Affiliations

  1. Thick and thin film device lab, Department of physics, Shivaji University, Kolhapur, 416004, India

    Rupali Jadhav, Deepti Kulkarni & Vijaya Puri

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  1. Rupali Jadhav
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  2. Deepti Kulkarni
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  3. Vijaya Puri
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Correspondence to Vijaya Puri.

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Jadhav, R., Kulkarni, D. & Puri, V. Structural and electrical properties of fritless Ni(1−x)Cu x Mn2O4 (0 ≤ x ≤ 1) thick film NTC ceramic. J Mater Sci: Mater Electron 21, 503–508 (2010). https://doi.org/10.1007/s10854-009-9946-8

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