Abstract
Microstructure and electromagnetic interference shielding effectiveness of electroless Ni–P deposits obtained from an alkaline hypophosphite reducing electroless nickel bath was studied. The effects of plating temperature on the deposition rate, surface morphology, chemical composition and structure of the electroless Ni–P deposits were investigated. Surface resistance and electromagnetic interference (EMI) shielding effectiveness (SE) of Ni–P plated polyester fabric were also evaluated. The results demonstrated electroless Ni–P plated polyester fabric present useful EMI shielding materials.
Similar content being viewed by others
References
G.H. Wu, X.L. Huang, Z.Y. Dou et al., J. Mater. Sci. 42, 2633 (2007). doi:10.1007/s10853-006-1347-2
Y.L. Yang, M.C. Gupta, K.L. Dudley, Nanotechnology 18, 345701 (2007)
Innovation 128, Technology Trend, Electromagnetic Interference Shielding-A Materials Perspective (Innovation 128, S. A. Paris, 1996)
O.S. Kwon, J.C. Jung, Y.H. Yoo, Polym. Korea 7(6), 342 (1983)
S. Yasufuku, IEEE Electr. Insul. Mag. 6(6), 947 (1995)
W.C. Smith, J. Coat. Fabrics 17, 243 (1988)
K. Bula, J. Koprowska, J. Janukiewicz, Fibers Text. Eastern Eur. 14(5), 75 (2006)
R.H. Guo, S.Q. Jiang, C.W.M. Yuen, M.C.F. Ng, J. Mater. Sci. Mater. Electron. (2008). doi:10.1007/s10854-008-9594-4
S.Q. Jiang, E. Newton, C.W.M. Yuen, C.W. Kan, Text. Res. J. 76, 57 (2006). doi:10.1177/0040517506053827
G.O. Mallory, J.B. Hadju, Electroless Plating (AESF, Orlando Florida, 1990)
W. Riedel, Electroless Nickel Plating (Finishing Publishers Ltd., England, 1991)
C.W.M. Yuen, S.Q. Jiang, C.W. Kan, Appl. Surf. Sci. 253, 5250 (2007). doi:10.1016/j.apsusc.2006.11.044
M. Simor, J. Rahel, M. Cernak, Surf. Coat. Technol. 172, 1 (2003). doi:10.1016/S0257-8972(03)00313-X
S.Q. Jiang, C.W. Kan, C.W.M. Yuen, J. Appl. Polym. Sci. 108, 2630 (2008). doi:10.1002/app.27154
M.R. Lambert, D.J. Duquette, Thin Solid Films 177, 207 (1989). doi:10.1016/0040-6090(89)90568-3
L.J. Wang, J. Li, Y.X. Liu, J. For. Res. 17, 1–53 (2006). doi:10.1007/s11676-006-0013-5
L.M. Abrantes, J.P. Correya, J. Electrochem. Soc. 141, 2356 (1994). doi:10.1149/1.2055125
M.E. Touhami, E. Chassaing, M. Cherkaoui, Electrochim. Acta 43, 1721 (1998). doi:10.1016/S0013-4686(97)00322-8
W.J. Cheong, B.L. Luan, D.W. Shoesmith, Appl. Surf. Sci. 229, 282 (2004). doi:10.1016/j.apsusc.2004.02.003
A.X. Zeng, W.H. Xiong, J. Xu, Surf. Coat. Technol. 197, 142 (2005). doi:10.1016/j.surfcoat.2005.01.009
H.B. Dai, H.X. Li, F.H. Wang, Appl. Surf. Sci. 253, 2474 (2006). doi:10.1016/j.apsusc.2006.05.010
J.W. Yoon, J.H. Park, C.C. Shur, S.B. Jung, Microelectron. Eng. 84, 2552 (2007)
M.I. Mendelev, D.J. Srolovitz, Model. Simul. Mater. Sci. Eng. 10, R79 (2002). doi:10.1088/0965-0393/10/6/201
J.N. Balaraju, T.S.N. Sankara Narayanan, S.K. Seshadri, Mater. Res. Bull. 41, 847 (2006). doi:10.1016/j.materresbull.2005.09.024
I. Baskaran, T.S.N. Sankara Narayanan, A. Stephen, Mater. Chem. Phys. 99, 17 (2006). doi:10.1016/j.matchemphys.2005.10.001
B.E. Warren, X-ray Diffraction (Dover Publications, New York, 1990)
B.J. Holland, J.N. Hay, Polymer (Guildf) 43(6), 1835 (2002). doi:10.1016/S0032-3861(01)00775-3
C.R. Paul (ed.), Introduction of Electromagnetic Compatibility (Wiley, New York, 1992)
Acknowledgements
The authors acknowledge the financial support of The Hong Kong Polytechnic University and the technical support of the Materials Research Centre of The Hong Kong Polytechnic University.
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Guo, R.H., Jiang, S.Q., Yuen, C.W.M. et al. Microstructure and electromagnetic interference shielding effectiveness of electroless Ni–P plated polyester fabric. J Mater Sci: Mater Electron 20, 735–740 (2009). https://doi.org/10.1007/s10854-008-9795-x
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s10854-008-9795-x