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Electroless Nickel Metallization on Palladium-free Activated Polyamide Fabric for Electromagnetic Interference Shielding

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Abstract

In this work, a novel palladium-free and environmentally friendly surface activation process was applied to prepare nickel plated fabric. Firstly, chitosan (CTS) film was formed on the polyamide (PA) surfaces. Then, the electroless nickel plating was carried out on the surface of textile in the absence of Sn through the electroless plating technique. The morphology of nickel-plated PA fabrics was characterized by scanning electron microscope (SEM), energy disperse spectroscopy (EDS) and X-ray diffraction patterns (XRD). The plated nickel fabric exhibited saturation magnetization with coating mass of 331.4 emu/g and good electromagnetic shielding effectiveness (50 dB) in frequency range from 300 KHz to 3000 MHz). This approach reveals a promising potential to fabricate electromagnetic shielding materials, in which nickel salt is as activator instead of metallic palladium to realize the palladium-free activation.

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Acknowledgements

This work was financially supported by the National Natural Science Foundation of China (51303022, 51203018) and the Shanghai Municipal Natural Science Foundation (12ZR1400400). The research was also funded by the Fundamental Research Funds for the Central Universities (2232015D3-17).

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Authors and Affiliations

  1. Key Lab of Science & Technology of Eco-textile, Ministry of Education College of Chemistry, Chemical Engineering and Biotechnology, Donghua University, Shanghai, 201620, China

    Mingliu Li, Lifang Su, Zhendong Jin, Zaisheng Cai & Yaping Zhao

  2. China Textile Information Center, Beijing, 100125, China

    Bingzheng Song

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  1. Mingliu Li
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  2. Bingzheng Song
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  3. Lifang Su
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  4. Zhendong Jin
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  5. Zaisheng Cai
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  6. Yaping Zhao
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Correspondence to Yaping Zhao.

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Li, M., Song, B., Su, L. et al. Electroless Nickel Metallization on Palladium-free Activated Polyamide Fabric for Electromagnetic Interference Shielding. Fibers Polym 22, 2433–2439 (2021). https://doi.org/10.1007/s12221-021-0992-z

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  • DOI: https://doi.org/10.1007/s12221-021-0992-z

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