Abstract
This work aims at investigating the mechanical properties and behaviors of orthorhombic Cu3Sn crystals at room temperature through molecular dynamics (MD) simulation. The focuses are placed on the tensile stress–strain behaviors and properties of the Cu3Sn single crystal and also their dependence on applied strain and strain rate. An attempt to characterize the deformation evolution of the Cu3Sn nanostructure during the stress–strain test is also made. In addition, the elastic properties of bulk polycrystalline Cu3Sn are estimated, as a function of strain rate and applied strain, by using the monocrystal results. The effectiveness of the MD model is demonstrated through comparison with the nanoindentation results and also published theoretical and experimental data. The calculated orthotropic elastic and shear moduli and Poisson’s ratio of Cu3Sn single crystal reveal not only high anisotropy, but also the great effects of applied strain and strain rate only as the strain rate exceeds a threshold value of about 0.072% ps−1. Specifically, raising the strain rate increases the orthotropic elastic properties and also the ultimate tensile and shear strengths of the nanocrystal, whereas increasing the applied strain reduces them.
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Suganuma K (2001) Curr Opin Solid State Mater Sci 5:55
Fangjie C, Hiroshi N, Tadashi T (2008) J Mater Sci 43:3643. doi:10.1007/s10853-008-2580-7
Lee YG, Duh JG (1998) J Mater Sci 33:5569. doi:10.1023/A:1004499728840
Yoon JW, Jung SB (2004) J Mater Sci 39:4211. doi:10.1023/B:JMSC.0000033401.38785.73
Yao D, Shang JK (1995) Metall Mater Trans A 26:2677
Kim JY, Sohn YC, Yu J (2007) J Mater Res 22:770
Fields RJ, Low SR III, Lucey GK Jr (1992) In: Cieslak MJ, Perepezko JH, Kang S, Glicksman ME (eds) The metal science of joining. TMS, Warrendale, PA, p 165
Albrecht HJ, Juritza A, Muller K, Sterthaus J, Villain J, Vogliano A (2003) IEEE, EPTC:0-7803-8205
Chromik RR, Vinci RP, Allen SL, Notis MR (2003) J Mater Res 18:2251
Deng X, Chawla N, Chawla KK, Koopman M (2004) Acta Mater 52:4291
Ghosh G (2004) J Mater Res 19:1439
Jang GY, Lee JW, Dun JG (2004) J Electron Mater 33:1103
Xu L, Pang JHL (2006) Thin Solid Films 504:362
Yang PF, Lai YS, Jian SR, Chen J (2007) IEEE, EPTC:1-4244-1392
Kart SO, Erbay A, Kilic H, Cagin T, Tomak M (2008) J Achiev Mater Manuf Eng 31:41
Lee NTS, Tan VBC, Lim KM (2006) Appl Phys Lett 88:031913
An R, Wang C, Tian T, Wu H (2008) J Electron Mater 37:477
Chen J, Lai YS, Ren CY, Huang DJ (2008) Appl Phys Lett 92:081901
Pang XY, Wang SQ, Zang L, Liu ZQ, Shang JK (2008) J Alloys Compd 466:517
Yang Y, Lu H, Yu C, Chen J (2009) ICEPT-HDP:978-1-4244-4659
Chen WH, Cheng HC, Yu CF (2010) IEEE EuroSim 2010:1
Zhou W, Liu L, Wu P (2010) Intermetallics 18:922
Baskes MI, Nelson JS, Wright AF (1989) Phys Rev B 40:6085
Baskes MI (1992) Phys Rev B 46:2727
Baskes MI (1997) Mater Chem Phys 50:152
Verma JKD, Nag BD (1965) J Phys Soc Jpn 20:635
Hill R (1952) Proc Phys Soc 65:350
Rose JH, Smith JR, Ferrante J (1984) Phys Rev B 29:2963
Chromik RR, Cotts ET (1995) In: Im JS, Park B, Greer AL, Stephenson GB (eds) Thermodynamics and kinetics of phase transformations, Pittsburgh, Proc Mater Res Soc, vol 398, p 307
Ravelo RJ, Baskes MI (1997) Phys Rev Lett 79:2482
Bodig J, Jayne BA (1993) Mechanics of wood and wood composite. Krieger Publishing Company, Malabar, FL
Oliver WC, Pharr GM (1992) J Mater Res 7:1564
Villar P, Calvet LD (1991) Pearson’s handbook of crystallographic data for intermetallic phase 3, 2nd edn. ASM International, Materials Park, OH, p 3007
Berendsen HJC, Postma JPM, van Gunsteren WF, DiNola A, Haak JR (1984) J Chem Phys 81:3684
Zhou M (2003) Proc R Soc A 459:2347
Ikeda H, Qi Y, Cagin T, Samwer K, Johnson WL, Goddard WA III (1999) Phys Rev Lett 82:2900
Branı′cio PS, Rino JP (2000) Phys Rev B 62:16950
Sankaranarayanan SKRS, Bhethanabotla VR, Joseph B (2007) Phys Rev B 76:134117
Follansbee PS (1986) In: Murr LE, Staudhammer KP, Meyers MA (eds) Metallurgical applications of shock-wave and high-strain-rate phenomena. Marcel Dekker, New York, p 451
Shchukin ED, Yushchenko VS (1981) J Mater Sci 16:313. doi:10.1007/BF00738620
Park HS, Zimmerman JA (2005) Phys Rev B 72:054106
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The work is partially supported by National Science Council, Taiwan, R.O.C., under Grants NSC98-2221-E-007-016-MY3 and NSC99-2221-E-035-021.
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Cheng, HC., Yu, CF. & Chen, WH. Strain- and strain-rate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation. J Mater Sci 47, 3103–3114 (2012). https://doi.org/10.1007/s10853-011-6144-x
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DOI: https://doi.org/10.1007/s10853-011-6144-x