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TEM microstructural analysis of As-Bonded Al–Au wire-bonds

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Abstract

In this study the interface morphology of a model 99.999% (5N) Au wire bonded to Al pads in the as-bonded state was examined by scanning/transmission electron microscopy with energy dispersive spectroscopy. Specimens for transmission electron microscopy were prepared using the lift-out method in a dual-beam focused ion beam system. Analysis of the bond microstructure was conducted as a function of the Al pad content and as a function of the bonding temperature. Additions of Si and Cu to the Al pad affect the morphology and the uniformity of the interface. A characteristic-void line is formed between two intermetallic regions with different morphologies in the as-bonded samples. According to the morphological analysis it was concluded that a liquid phase forms during the bonding stage, and the void-line formed in the intermetallic region is the result of shrinkage upon solidification and not the Kirkendall effect.

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References

  1. Harman G (1997) Wire-bonding in microelectronics materials process reliability and yield. McGraw-Hill Publishers

  2. Noolu NJ, Murdeshwar NM, Ely KJ, Lippold JC, Baeslack WA (2004) J Mater Res 19(5):1374

    Article  CAS  Google Scholar 

  3. Breach CD, Wulff F (2004) Microelectron Reliabil 44(6):973

    Article  CAS  Google Scholar 

  4. Koeninger V, Uchida HH, Fromm E (1995) IEEE Trans Comp Pack Manufact Technol Part A 18(4):835

    Article  CAS  Google Scholar 

  5. Chang HS, Hsieh KC, Martens T, Yang A (2004) IEEE Trans Comp Pack Technol 27(1):155

    Article  CAS  Google Scholar 

  6. Maiocco L, Smyers D, Kadiyala S, Baker I (1990) Mater Character 24(4):293

    Article  CAS  Google Scholar 

  7. Rooney DT, Schurr KG, Northrup MR (1996) Evaluation of wire quality by SEM analysis of ball-shape and visual inspection of intermetallic formation, ISHM 96 Proceedings: 432–433

  8. Philofsky E (1970) Solid-State Electron 13(10):1391

    Article  CAS  Google Scholar 

  9. Ueno H (1992) Mater Trans, JIM 33(11):1046

    Article  CAS  Google Scholar 

  10. Breach CD, Tok CW, Wulff F, Calpito D (2004) J Mater Sci 39(19):6125

    Article  CAS  Google Scholar 

  11. Williams DB, Carter BC (1996) Transmission electron microscopy. Plenum, New York

    Book  Google Scholar 

  12. Reyntjens S, Puers R (2001) J Micromech Microeng 11(4):287

    Article  CAS  Google Scholar 

  13. Clatterbaugh GV, Weiner JA, Charles HK (1984) IEEE Trans Comp Hybrid Manufact Technol 7(4):349

    Article  Google Scholar 

  14. Bowden P, Brandon DG (1963) J Nucl Mater 9(3):348–354

    Article  CAS  Google Scholar 

  15. Villars P (1991) Pearson’s handbook of crystallographic data for intermetallic phases, 2nd edn, Vol. 1. ASM International, Materials Park, Ohio, pp 652–653

    Google Scholar 

  16. Okomoto H (1991) J Phase Equilib 12(1):114–115

    Article  Google Scholar 

  17. Zhang X, Yan TT (2006). Thin solid films, proceedings of the international conference on materials for advanced technologies (ICMAT 2005) Symposium H: silicon microelectronics: processing to packaging—ICMAT 2005 Symposium H, 504(1–2):355–361

  18. Smithells CJ (1992) Smithells metals reference book, 7th edn. Butterworth-Heinemann, Oxford

    Google Scholar 

  19. Ramsey TH, Alfaro C (1997) Semiconductor Int 20(9):93–94, 96

    CAS  Google Scholar 

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Acknowledgements

The authors thank the Russell Berrie Nanotechnology Institute at the Technion for use of the dual-beam FIB, and I. Popov for assistance with use of the TEM.

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Authors and Affiliations

  1. Department of Materials Engineering, Technion—Israel Institute of Technology, Haifa, 32000, Israel

    Adi Karpel & Wayne D. Kaplan

  2. Kulicke & Soffa Bonding Tools, Yokneam Elite, 20692, Israel

    Giyora Gur & Ziv Atzmon

Authors
  1. Adi Karpel
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  2. Giyora Gur
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  3. Ziv Atzmon
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  4. Wayne D. Kaplan
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Corresponding author

Correspondence to Wayne D. Kaplan.

Appendix

Appendix

 

Structure Type

Pearson symbol

Space Group

Lattice Parameters [nm]

Al3Au8 [15]

Al3Au8

hR44

\(R\overline 3 c\)

a = 0.7724 c = 4.2083

AlAu4 [15]

W

cI2

\(\text{Im} \overline 3 m\)

a = 0.324

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Karpel, A., Gur, G., Atzmon, Z. et al. TEM microstructural analysis of As-Bonded Al–Au wire-bonds. J Mater Sci 42, 2334–2346 (2007). https://doi.org/10.1007/s10853-007-1592-z

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  • DOI: https://doi.org/10.1007/s10853-007-1592-z

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