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Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires

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Abstract

Silver-based bonding wires such as Ag-4Pd and Ag-8Au-3Pd have drawn remarkable attention in the packaging industry because they are cheaper and more conductive than Au- and Cu-based wires, respectively. This study aimed to investigate the intermetallic compound (IMC) formation and growth at the bonding interface between Ag-4Pd wire and Al-pads and between Ag-8Au-3Pd wire and Al-pads. The as-bonded and reliability-tested Ag-4Pd/Al and Ag-8Au-3Pd/Al specimens were then investigated by transmission electron microscopy (TEM) and scanning transmission electron microscopy equipped with energy-dispersive X-ray spectroscopy (STEM-EDS). The bonding properties were examined by ball shear and wire pull tests. In the as-bonded state, hexagonal close-packed (HCP) (Ag, Pd)2Al and HCP Ag2Al were formed at the Ag-4Pd/Al interfaces, whereas dual phase consisting of face-centered cubic Ag alloy with HCP precipitates (Ag, Au, Pd)2Al crystals and HCP Ag2Al layers were observed at the Ag-8Au-3Pd/Al interfaces. The IMCs showed significant growth and oxidation during reliability tests at 130 °C and 85 pct relative humidity for 192 hours. Alloying Au in Ag-4Pd wires promoted the growth of the IMC layer and it also enhanced the mechanical properties in the as-bonded material. By contrast, overgrowth of the IMCs in the Ag-8Au-3Pd/Al system induced microcrack formation in bonding and thus degraded the reliability of the material.

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Acknowledgments

This work is supported in part by the Ministry of Education, Taiwan, R.O.C. under the Higher Education Sprout Project and the Wire Technology Co. Ltd., Taichung, Taiwan.

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Authors and Affiliations

  1. Department of Materials Science and Engineering, National Chung Hsing University, Taichung, Taiwan

    Bing-Hau Kuo, Du-Cheng Tsai, Yen-Lin Huang & Fuh-Sheng Shieu

  2. Department of Materials Engineering, KU Leuven, Leuven, Belgium

    Po-Chun Hsu

  3. Department of Materials Science and Engineering, National Taiwan University, Taipei, Taiwan

    Tung-Han Chuang

  4. Wire Technology Co. Ltd, Taichung, Taiwan

    Hsing-Hua Tsai

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  1. Bing-Hau Kuo
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Correspondence to Fuh-Sheng Shieu.

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Manuscript submitted July 25, 2017.

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Kuo, BH., Tsai, DC., Huang, YL. et al. Effect of Au Addition on the Microstructure and Properties of Ag-4Pd Bonding Wires. Metall Mater Trans A 49, 5411–5422 (2018). https://doi.org/10.1007/s11661-018-4841-7

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  • DOI: https://doi.org/10.1007/s11661-018-4841-7

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