Skip to main content
SpringerLink
Log in

In-situ SEM observation on fracture behaviors of Sn-based solder alloys

  • Published:
Journal of Materials Science Aims and scope Submit manuscript

Abstract

The effects of displacement rate on fracture behaviors of 100Sn solder and 63Sn37Pb solder alloys have been investigated by SEM in-situ testing. It was found that for the 100Sn solder, grain boundary sliding was the dominant deformation mechanism at lower tensile rate regime, while a large area of slip lines crossing grains were detected at the surface of specimens at higher tensile rate regime. For the 63Sn37Pb eutectic alloy, however, because of existence of the second phase, fracture behavior depended on the growth and linkage of cavities ahead of crack tip, and the crack paths changed from intergranular to transgranular with the increasing of loading rate.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. S. VAYNMAN, G. GHOSH and M. E. FINE, J. Electron. Mater. 27(11) (1998) 1223.

    Google Scholar 

  2. M. E. FINE, V. STOLKARTS and L. M. KEER, Mater. Sci. Eng. A 272 (1999) 5.

    Google Scholar 

  3. S. RUSSELL, A. GRIGALS and E. CLEMENTE, J. Electron. Mater. 28(9) (1999) 1008.

    Google Scholar 

  4. W. W. LEE, L. T. NGUYEN and G. S. SELVADURAY, Microelectr. Relia. 40 (2000) 231.

    Google Scholar 

  5. TSUNG-YU PAN, IEEE Trans. CHMT 14(4) 824.

  6. S. K. KANG and A. K. SARKHEL, J. Electron. Mater. 23(8) (1994) 701.

    Google Scholar 

  7. S. M. LEE and D. S. STONE, Scripta Metallur. et Mater. 30(9) (1994) 1213.

    Google Scholar 

  8. C. KANCHANOMAI, Y. MIYASHITA and Y. MUTOCH, Int. J. Fatigue 24 (2002) 987.

    Google Scholar 

  9. C. KANCHANOMAI, S. YAMAMOTO, Y. MIYASHITA, Y. MUTOH and A. J. MC EVILY, ibid. 24 (2002) 57.

    Google Scholar 

  10. C. KANCHANOMAI, Y. MIYASHITA and Y. MUTOH, ibid. 24 (2002) 671.

    Google Scholar 

  11. J. ZHAO, Y. MIYASHITA and Y. MUTOH, ibid 22 (2000) 665.

    Google Scholar 

  12. Idem., ibid. 23 (2001) 723.

    Google Scholar 

  13. S. H. GOOD and L. M. BROWN, Acta Metallur. 27 (1979) 1.

    Google Scholar 

  14. R. C. GIFKINS, Scripta Metallur. et Mater. 25(6) (1991) 1397.

    Google Scholar 

  15. HAEL MUGHRABI-WEINHEIM, in “Materials Science and Technology: A Comprehensive Treatment” (Cambridge, New York, 1998) p. 7.

    Google Scholar 

  16. R. RAI and M. F. ASHBY, Acta Metallur. 23 (1975) 653.

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, 92, Xidazhi Street, Nangang, Harbin, 150001, People’s Republic of China

    Ding Ying, Wang Chunqing & Bang Han-Sur

  2. Shenzhen Graduate School of Harbin Institute of Technology, Xili Shenzhen University Town, Shenzhen, 518055, People’s Republic of China

    Li Mingyu

  3. Department of Naval Architecture and Ocean Engineering, Chosun University, 375, Seosek Dong, Donggu, Guangju, 501-759, Korea

    Bang Han-Sur

Authors
  1. Ding Ying
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Wang Chunqing
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Li Mingyu
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Bang Han-Sur
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Ding Ying.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Ying, D., Chunqing, W., Mingyu, L. et al. In-situ SEM observation on fracture behaviors of Sn-based solder alloys. J Mater Sci 40, 1993–2001 (2005). https://doi.org/10.1007/s10853-005-1222-6

Download citation

  • Received:

  • Accepted:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10853-005-1222-6

Keywords

Search

Navigation