Skip to main content
SpringerLink
Log in

Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle Fatigue

  • Published:
Acta Metallurgica Sinica (English Letters) Aims and scope

Abstract

In this study, a crack initiation and propagation behavior of Sn–5Sb lead-free solder under low-cycle fatigue is discussed. Cyclic push–pull loading tests with a single-hole specimen have been conducted at 313 K to investigate the crack initiation and propagation behavior of Sn-5Sb solder which has a higher melting point temperature than that of Sn–Ag–Cu solders. A fatigue life ratio correlates with the crack length within a small scatter. Crack initiates at the early stage, and almost all the life period is crack propagation process independent of strain range and strain rate. The crack propagation rate depends on the strain range and the strain rate. The adaptation of J-integral value for Sn–5Sb solder is also discussed. J-integral value is a suitable parameter for crack propagation rate evaluation.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8

Similar content being viewed by others

References

  1. J. Thambia, U. Tetzlaffb, A. Schiessla, K.D. Langc, M. Waltzb, Microelectron. Reliab. 6, 98 (2016)

    Article  Google Scholar 

  2. N. Hiyoshi, Mech. Eng. J. 3, 16–00081 (2016)

    Article  Google Scholar 

  3. T.Y. Hung, C.J. Huang, C.C. Leed, C.C. Wange, K.C. Lue, K.N. Chiang, Microelectron. Eng. 107, 125 (2013)

    Article  Google Scholar 

  4. T. Yamamoto, T. Itoh, M. Sakane, Y. Tsukada, Int. J. Fatigue 43, 235 (2012)

    Article  Google Scholar 

  5. M. Nozaki, S. Zhang, M. Sakane, K. Kobayashi, Eng. Fract. Mech. 78, 1794 (2011)

    Article  Google Scholar 

  6. K. Fakpana, Y. Otsukab, Y. Mutohb, S. Inouec, K. Nagatad, K. Kodanid, Procedia Eng. 10, 1238 (2011)

    Article  Google Scholar 

  7. M. Nozaki, M. Sakane, Y. Tsukada, Int. J. Fatigue 30, 1729 (2008)

    Article  Google Scholar 

  8. X. Chen, J. Song, K.S. Kim, Int. J. Fatigue 28, 757 (2006)

    Article  Google Scholar 

  9. H. Nose, M. Sakane, M. Yamashita, K. Shiokawa, Trans. Jpn. Soc. Mech. Eng. Ser. A 68, 88 (2002)

    Article  Google Scholar 

  10. The Society of Materials Science, Japan, Factual Database on Tensile, Creep, Low Cycle Fatigue and Creep-fatigue of Lead and Lead-free Solders (The Society of Materials Science, Kyoto, 2013)

  11. W.D. Pilkey, D.F. Pilkey, Peterson’s Stress Concentration Factors (Wiley, New York, 2008)

    Google Scholar 

  12. The Society of Materials Science, Japan, Standard Low Cycle Fatigue Testing for Solders (The Society of Materials Science, Kyoto, 2000)

  13. N. Hiyoshi, T. Itoh, M. Sakane, J. Soc. Mater. Sci. Jpn. 58, 162 (2009)

    Article  Google Scholar 

  14. N. Hiyoshi, A. Katoh, M. Sakane, Y. Tsukada, J. Soc. Mater. Sci. Jpn. 58, 155 (2009)

    Article  Google Scholar 

  15. N.E. Dowling, ASTM STP 601, American Society for Testing and Materials, 19–32 (1976)

Download references

Acknowledegments

I am grateful to Dr. Takamoto Itoh, a professor in Ritsumeikan University for helpful discussion. I also gratefully acknowledge the work of past members Mr. Hirokatsu Yamamoto, undergraduate student in University of Fukui, and Mr. Kazuki Terahara, graduate student in Ritsumeikan University.

Author information

Authors and Affiliations

  1. Division of Engineering, Faculty of Engineering, University of Fukui, 3-9-1 Bunkyo, Fukui-shi, Fukui, 910-8507, Japan

    Noritake Hiyoshi

Authors
  1. Noritake Hiyoshi
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Noritake Hiyoshi.

Additional information

Available online at http://link.springer.com/journal/40195

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Hiyoshi, N. Crack Initiation and Propagation Evaluation for Sn–5Sb Solder Under Low-Cycle Fatigue. Acta Metall. Sin. (Engl. Lett.) 30, 851–856 (2017). https://doi.org/10.1007/s40195-017-0605-4

Download citation

  • Received:

  • Revised:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s40195-017-0605-4

Keywords

Search

Navigation