Abstract
Experimentally substantiated recommendations on selecting compositions and technologies for synthesis of glass solders with assigned properties within the soldering temperature limits of 390–450°C and CLTE of (60–70) × 10−7 K−1, designed for hermetically sealing the ceramic packages of integrated microcircuits are reported.
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Translated from Steklo i Keramika, No. 9, pp. 27–33, September, 2007.
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Geodakyan, D.A., Petrosyan, B.V. & Geodakyan, K.D. Design and synthesis of fusible glass solder with previously assigned properties. Glass Ceram 64, 326–332 (2007). https://doi.org/10.1007/s10717-007-0083-7
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DOI: https://doi.org/10.1007/s10717-007-0083-7