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Fundamentals of high power pulsed magnetron sputtering: Visualization of mechanisms for rate reduction and increased ion fraction

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Czechoslovak Journal of Physics Aims and scope

Abstract

High power pulsed magnetron sputtering (HPPMS) has attracted a great deal of interest because of its potential to provide a highly ionized flux of target material to the substrate. However, practical experience with HPPMS has shown deposition rates typically lower than direct current sputtering (DC sputtering) rates at the same average power, and ionization fractions of target material flux to the substrate often lower than anticipated. A mathematical model explaining the source of these observed process characteristics has been proposed by the author previously. Here, a graphical means of visualizing the mechanism for deposition rate reduction and lower than expected ionization fractions is presented.

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Authors and Affiliations

  1. Advanced Energy Industries, Inc. 1625 Sharp Point Drive, Fort Collins, CO 80525, USA

    D. J. Christie

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  1. D. J. Christie
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Christie, D.J. Fundamentals of high power pulsed magnetron sputtering: Visualization of mechanisms for rate reduction and increased ion fraction. Czech J Phys 56 (Suppl 2), B93–B97 (2006). https://doi.org/10.1007/s10582-006-0183-6

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  • DOI: https://doi.org/10.1007/s10582-006-0183-6

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