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Design of a packaging-friendly double-topology RF MEMS switch for space applications

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Abstract

This article presents the results of the research, design and a series of manufacturing steps of an RF-MEMS switch to be used in space communication systems. Design and measurement results are discussed. Double-topology geometry for anodic bonding is presented.

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References

  • Alagashev GK, Savin EA (2017) Development of RF MEMS cantilever beam to maximize capacitance in an activated state. Int J Appl Eng Res 12(15):5169–5172

    Google Scholar 

  • De Pasquale G, Veijola T, Somà A (2009) Modelling and validation of air damping in perforated gold and silicon MEMS plates. J Micromech Microeng 20(1):1–12

    Google Scholar 

  • Giacomozzi F et al (2015) RF-MEMS packaging by using quartz caps and epoxy polymers. Microsyst Technol 21(9):1941–1948

    Article  Google Scholar 

  • Huang S, Zhang X (2007) Gradient residual stress induced elastic deformation of multilayer MEMS structures. Sens Actuators A 134(1):177–185

    Article  Google Scholar 

  • http://www.btlabs.ru/. Accessed 20 Apr 2018

  • http://russianspacesystems.ru/. Accessed 20 Apr 2018

  • https://mipt.ru/about/departments/ckpn/. Accessed 20 Apr 2018

  • Iannacci J (2003) Practical guide to RF-MEMS. Wiley-VCH, Singapore

    Google Scholar 

  • Iannacci J (2018) Surfing the hype curve of RF-MEMS passive components: towards the 5th generation (5G) of mobile networks. J Microsyst Technol. https://doi.org/10.1007/s00542-018-3718-4

    Google Scholar 

  • Kingsley N, Ponchak GE, Papapolymerou J (2008) Reconfigurable RF MEMS phased array antenna integrated within a liquid crystal polymer (LCP) system-on-package. IEEE Trans Antennas Propag 56(1):108–118

    Article  Google Scholar 

  • Quaranta F et al (2018) Wafer-level micropackaging in thin film technology for RF MEMS applications. Microsyst Technol 24(1):575–585

    Article  Google Scholar 

  • Sano K et al (2006) RF MEMS switch up to 20 GHz with wafer level packaging. In: Transaction of the society of instrument and control engineers, vol E-S-1(1) 11/15

  • Savin EA, Chadin KA, Kirtaev RV (2017) Design and manufacturing of X-band RF MEMS switches. Microsyst Technol. https://doi.org/10.1007/s00542-017-3629-9

    Google Scholar 

  • Seki T (2004) Recent progress in packaging of RF MEMS. In: Compound semiconductor integrated circuit symposium proceedings

  • Vaha-Haikkila T et al (2007) RF MEMS impedance tuners for 6–24 GHz applications. Int J RF Microw Comput Aided Eng 17(3):265–278

    Article  Google Scholar 

  • Zhukov AA et al (2006) The way of manufacturing via-holes in silicon substrates. Patent RF RU 2 629 926 C1MПК H01L 21/768 from 04.09.17 (in Russian)

  • Zhukov AA et al (2017) Profile, morphology and elemental composition of the via micro-holes surfaces in silicon wafers. In: Surface, X-ray, synchrotron and neutron research 10, pp 38–43 (in Russian)

  • Zhukov AA, Grebenyuk EI, Sagitov GM (2017) Diffraction control method of the via micro-holes in the precise devises. Devices 5:29–36 (in Russian)

    Google Scholar 

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Acknowledgements

This work has been supported by the Ministry of Education and Science of the Russian Federation under the Federal target program “Research and Development in Priority Directions of the Russian Science and Technology Complex in 2014–2020”; contract no. 14.579.21.0137; unique project identifier RFMEFI57916X0137. Experiments have been performed using the equipment of MIPT Shared Facilities Centre.

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Correspondence to Evgeny A. Savin.

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Savin, E.A., Kirtaev, R.V., Zhukov, A.A. et al. Design of a packaging-friendly double-topology RF MEMS switch for space applications. Microsyst Technol 25, 51–55 (2019). https://doi.org/10.1007/s00542-018-3929-8

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  • DOI: https://doi.org/10.1007/s00542-018-3929-8

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