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Fracture complexions of a nanocrystalline microstructure

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Abstract

The nano-dimple fracture complexions assessed from the published tensile fracture surfaces are perceived to predict the trend of variation in deformation and fracture properties of a supersaturated nanocrystalline face-centered cubic Cu–Co alloy with systematic isothermal annealing treatment. The alteration of different microstructural disposition that led to change in fracture complexions have been quantified, compared and interpreted with the respective mechanical properties of the alloy.

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Data accessibility

The data consist of experimental and analytical outputs that have been plotted in the figures in the manuscript. The datasets generated and analyzed during the current study are available from the corresponding author on reasonable request.

Notes

  1. Complex interplay between initial microstructural features and stress/strain field generated due to tension. Before tensile tests, the initial microstructures are different due to variation in annealing states (and after deformation), see Table 1.

Abbreviations

ar:

Grain aspect ratio

ATP:

Atom probe tomography

bcc:

Body centered cubic

BSE:

Backscatter electron

\(\mu\) :

Dimple intercept length, Dimple size

\(\dot{\epsilon }\) :

Strain rate

\(\eta\) :

Median of dimple sizes

\(\epsilon _\textrm{p}\) :

Plastic strain

\(\epsilon _\textrm{N}\) :

Void nucleation strain

EL:

Total elongation

f v :

Void volume fraction

f :

Dimple frequency

fcc:

Face centered cubic

FEL:

Elongation to fracture

G :

Dimple size numbers

GB:

Grain boundary

GBTP:

Grain boundary triple points

GS:

Grain size

HEXRD:

In situ high-energy X-ray diffraction

hcp:

Hexagonal close pack

HPT:

High pressure torsion

H/T :

Heat treatment

lp:

Lattice parameter

Mo:

Mode of dimple sizes

n :

Dimple number density

RA:

Reduction in area

\(\rho\) :

Dislocation density

\(\sigma\) :

Standard deviation of dimple sizes

\(\sigma ^2\) :

Variance of dimple sizes

SE:

Secondary electron imaging

SEM:

Scanning electron microscope

\(\tau\) :

Stress triaxiality

\(\sigma _\textrm{h}\) :

Hydrostatic tensile stress

\(\sigma _\textrm{N}\) :

Void nucleation stress

U :

Deformation energy, area under ‘stress–strain’ curves

UEL:

Uniform elongation

UTS:

Ultimate tensile strength

YS:

Yield strength

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The insightful suggestions, comments and strong recommendations about the manuscript by the anonymous reviewers are gratefully appreciated. The comments were very helpful in improving the paper quality.

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    Arpan Das

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Das, A. Fracture complexions of a nanocrystalline microstructure. Appl. Phys. A 129, 667 (2023). https://doi.org/10.1007/s00339-023-06913-6

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