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Experimental investigation on additive manufactured single and curved double layered microchannel heat sink with nanofluids

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Abstract

For the latest high density compact devices, thermal management is crucial for their effective heat dissipation and system reliability. In literature, microchannel heat sink has been established as one of the advanced heat transfer techniques to fulfill the cooling demands of high power electronic applications. However, maldistribution in microchannels causes flow induced high temperature zones (FITZ) which reduces the electrical performance owing to electrical-thermal instability of the integrated chips. One way to mitigate the FITZ is by allowing more coolant inlets in these zones. In the current study, this is achieved by redesigning double layer microchannel heat sink (DMCHS) specific to the FITZ of I-type microchannel configuration using additive manufacturing (AM). Two AM microchannels were tested, one is a single layer microchannel heat sink (MCHS) and another one is a curved double layer microchannel (C-DMCHS). The curved channels were introduced in the bottom channels of C-DMCHS to mitigate FITZ compared to conventional DMCHS. AM microchannels are compared for Nusselt number and friction factor characteristics with the conventional straight channels, and heat treated AM microchannels. From experimental observation, Ti64 3D printed microchannel with Graphene oxide (GO-0.12%) nanofluid developed 75.4% more pressure drop than the Ti64 heat treated microchannel. The results additionally show that the C-DMCHS delivered 26.5% lower FITZ temperature than MCHS.

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Abbreviations

DMLS:

Direct metal laser sintering

µ-WEDM:

Micro-wire electric discharge machining

FITZ:

Flow induced high temperature zone

ABS:

Acrylonitrile butadiene styrene

GO:

Graphene oxide

MCHS:

Microchannel heat sink

DMCHS:

Double layer microchannel heat sink

C-DMCHS:

Curved- double layer microchannel heat sink

AM:

Additive manufacturing

EDM:

Electron beam melting

SLM:

Selective beam melting

HSS:

High speed steel

FHU:

Fluid handling unit

IN718:

Inconel

Ti64:

Titanium alloy

hx :

Heat transfer coefficient (W/m2 K)

Tw :

Wall temperature (°C)

Tf :

Fluid temperature (°C)

Tmax :

Maximum temperature of the sink (°C)

tout, LC :

Lower channel outlet temperature (°C)

tout :

Outlet temperature (°C)

tin :

Inlet temperature (°C)

th :

Temperature of the heater (°C)

LC, Fin :

Lower channel fluid inlet

LC, Fout :

Lower channel fluid outlet

LC, Pin :

Lower channel pressure inlet (kPa)

LC, Pout :

Lower channel pressure outlet (kPa)

Fin :

Fluid inlet

Fout :

Fluid outlet

Pin :

Pressure inlet (kPa)

Pout :

Pressure outlet (kPa)

Pp :

Pumping power (W)

Lc :

Lower channel

Uc :

Upper channel

Ra:

Surface roughness

uin :

Inlet velocity (m/s)

N:

Number of channels

Ach :

Area of the cross section (mm2).

Nux :

Nusselt number

Dh :

Hydraulic diameter of the channel (µm)

Re:

Reynolds number

kf :

Thermal conductivity of the working fluid (W/mK)

\({q}^{\prime\prime}\)  :

Heat flux (W/m2)

\(\dot{m}\) :

Mass flow rate (kg/s)

a:

Length of the channel (mm)

b:

Breadth of the channel (mm)

Cp :

Specific heat capacity (J/kgK)

d:

Average nanoparticle diameter (nm)

Ri :

Interfacial thermal resistance

Q:

Volumetric flow rate (L/min)

t1, t2, t3 :

Thermocouple locations in the microchananel

havg :

Average heat transfer coefficient

Nuavg :

Average Nusselt number

\(\eta\) :

Thermal enhancement factor

fhs :

Friction factor of the heat treated heat sink

fc :

Friction factor of the conventional heat sink

R:

Total thermal resistance (°C/Wm2)

Qh :

Total heat load generated by the chip (W)

µ:

Dynamic viscosity (mPa.s)

ρ:

Density (kg/m3)

ϕ:

Volume fraction of nanoparticles (%)

\(\alpha\) :

Kapitza constant

Δ:

Differential difference

x:

Location of the thermocouple measurement

w:

Microchannel wall

f:

Fluid

avg:

Average

in:

Inlet

out:

Outlet

p:

Particle

nf :

Nanofluid

bf :

Basefluid

ch:

Cross section

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Acknowledgements

The authors are very grateful to acknowledge the support provided by Center for System Design (CSD) in National Institute of Technology Karnataka, Surathkal (NITK) for supporting our experimental work with sensing and data acquisition systems.

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This research work has not been funded by any institute or an agency.

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Institute of Technology Karnataka, Surathkal, Mangaluru, 575 025, India

    Ganesan Narendran & N Gnanasekaran

  2. Department of Mechanical Engineering, Amrita School of Engineering, Amrita Vishwa Vidyapeetham, Coimbatore, 641112, India

    B Mallikarjuna

  3. Gas Turbine Research Establishment (GTRE), Ministry of Defense, DRDO, C V Raman Nagar, Bangalore, 560093, India

    B K Nagesha

  4. Department of Production Engineering, National Institute of Technology Tiruchirappalli, Tiruchirappalli, Tamilnadu, 620015, India

    B Mallikarjuna

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  1. Ganesan Narendran
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  2. B Mallikarjuna
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  4. N Gnanasekaran
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Correspondence to Ganesan Narendran.

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Narendran, G., Mallikarjuna, B., Nagesha, B.K. et al. Experimental investigation on additive manufactured single and curved double layered microchannel heat sink with nanofluids. Heat Mass Transfer 59, 1311–1332 (2023). https://doi.org/10.1007/s00231-022-03336-6

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