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Investigation of interlayer bonding during pneumatic extruding direct writing deposition

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Abstract   

At present, it is recognized that interlayer bonding plays a key role in the overall quality of additive manufacturing (AM)–fabricated parts. The purpose of this study was to investigate the mechanisms of interlayer bonding in the pneumatic extruding direct writing deposition (PEDWD) process that is a newly reported AM technique. The types and corresponding characteristics of different interlayer connections are discussed in this paper. The discussion results suggested that in PEDWD, the optimal type of interlayer connection is metallurgical bonding. To investigate the occurrence conditions and mechanism of interlayer metallurgical bonding, a physical model was built. By employing the physical model and a series of mathematical calculations, the temperature conditions for the occurrence of interlayer metallurgical bonding were predicted. Actual deposition experiments were conducted to validate the model, and the results indicated that the maximum difference between the theoretical calculations and the experimental results was approximately 13%. For interlayer metallurgical bonding formed during the PEDWD processes, the interfacial microstructure and the microscopic composition in the bonding region were observed and analyzed by scanning electron microscopy (SEM) and energy-dispersive spectrometry (EDS). To characterize the quality of interlayer bonding, the bonding degree was selected and defined as an index; the effects of the main experimental parameters on the bonding degree were investigated experimentally and analytically. The results of this study may provide guidance for setting the parameter values of PEDWD to obtain high quality parts.

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Funding

This work was supported by the guiding project on the scientific research plan of the Hubei Provincial Department of Education (Grant number B2021123) and the Research Funding of Wuhan Polytechnic University (Grant number 2021RZ015).

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Authors and Affiliations

  1. School of Mechanical Engineering, Wuhan Polytechnic University, Wuhan, Hubei, China

    Ming Ma, Zhigang Hu, Zhiyong Wang, Dandan Fu & Bin Li

  2. School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan, Hubei, China

    Ming Ma & Honghai Zhang

Authors
  1. Ming Ma
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  2. Zhigang Hu
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  3. Zhiyong Wang
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  4. Honghai Zhang
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  6. Bin Li
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Contributions

Ming Ma: Methodology, validation, investigation, funding acquisition, writing — original draft; Zhigang Hu: formal analysis, funding acquisition; Zhiyong Wang: methodology, resources; Honghai Zhang: conceptualization, writing — review and editing; Dandan Fu: formal analysis, visualization; Bin Li: writing — original draft.

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Correspondence to Honghai Zhang.

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Ma, M., Hu, Z., Wang, Z. et al. Investigation of interlayer bonding during pneumatic extruding direct writing deposition. Int J Adv Manuf Technol 128, 1365–1377 (2023). https://doi.org/10.1007/s00170-023-11994-x

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