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Research on the mapping grinding of dimple surface with ordered pattern based on topological theory

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Abstract

Since the structured dimple surface is one of the important functional drag-reducing surfaces, the research on its efficient fabrication technology is of great significance for the practical application of this surface. Therefore, in order to grind structured dimple surface, a topological mapping grinding method for structured dimple surface was proposed based on grinding kinematics principle and point set topology. Firstly, the topological spaces of the workpiece and the grinding wheel were established, and the topological features of the structured dimple surface and the structured grinding wheel were extracted based on the analysis of the topography features of the structured surface with ordered pattern. Then, the topology mapping equation of the grinding process was constructed based on the analysis of the generating mechanism of the dimple surface about grinding geometry, and the structured grinding wheel was designed according to the topology mapping equation. Finally, according to the grinding geometry simulation, the influence of grinding parameters on the generating of dimple surface topography was studied, and the grinding experiment was carried out. The results show that the structured grinding wheel designed based on the topological features of the structured dimple surface can achieve the grinding of the structured dimple surface. The ground dimple surface is a topological dimple surface, and its feature parameters can be changed with the change of grinding parameters, but the topological feature attributes remain unchanged under the condition of satisfying the proper grinding speed ratio.

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Funding

The authors gratefully acknowledge the support for this work from Chinese National Natural Science Foundation (no. 51875368).

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Authors and Affiliations

  1. School of Mechanical Engineering, Shenyang Ligong University, Shenyang, 110159, China

    Lyu Yushan, Wang Guoxun, Li Xingshan & Qi Yongchao

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  1. Lyu Yushan
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  2. Wang Guoxun
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  3. Li Xingshan
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  4. Qi Yongchao
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Contributions

Author 1 (first author): conceptualization, methodology, software, investigation, formal analysis, writing—original draft, Author 2: data curation, Author 3: visualization, investigation, Author 4: resources, writing—original draft.

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Correspondence to Wang Guoxun.

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Yushan, L., Guoxun, W., Xingshan, L. et al. Research on the mapping grinding of dimple surface with ordered pattern based on topological theory. Int J Adv Manuf Technol 121, 6205–6223 (2022). https://doi.org/10.1007/s00170-022-09711-1

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  • DOI: https://doi.org/10.1007/s00170-022-09711-1

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