Skip to main content
SpringerLink
Log in

Analysis of the uniformity of material removal in double-sided grinding based on thermal–mechanical coupling

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

In double-sided grinding, the material removal on the surface of the workpiece is non-uniform. The thermal deformation of the material may be one of the influencing factors. However, it is difficult to predict and measure the temperature field distribution in the workpiece in double-sided grinding. In this paper, based on the grain trajectory model, a single effective abrasive grain is regarded as a moving point heat source, and the new model of temperature field and workpiece thermal deformation is established based on the thermal–mechanical coupling effect. The distribution characteristics of the temperature field in the workpiece and the axial deformation of the workpiece under different processing parameters are calculated. Finally, a double-sided grinding experiment is carried out to measure the surface profile of the workpiece under different processing parameters to verify the accuracy of the established model. This article solves the problem of the unpredictable temperature field of the workpiece in double-sided grinding and has guiding significance for improving the surface quality of the workpiece in double-sided grinding through the optimization of processing parameters.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17
Fig. 18
Fig. 19

Similar content being viewed by others

Data Availability

All data, models and code generated or used during the study appear in the submitted article.

References

  1. Huo FW, Kang RK, Li Z, Guo DM (2013) Origin, modeling and suppression of grinding marks in ultra precision grinding of silicon wafers. Int J Mach Tools Manuf 66:54–65

    Article  Google Scholar 

  2. Pietsch GJ, Kerstan M (2005) Understanding simultaneous double-disk grinding: operation principle and material removal kinematics in silicon wafer planarization. Precis Eng 29(2):189–196

    Article  Google Scholar 

  3. Hocheng H, Tsai HY, Tsai MS (2000) Effects of kinematic variables on nonuniformity in chemical mechanical planarization. Int J Mach Tools Manuf 40(11):1651–1669

    Article  Google Scholar 

  4. Su JX (2006) Study on material removal mechanism of wafer chemical mechanical polishing in IC manufacturing. PhD thesis, Dalian University of Technology, Deijing

  5. Kasai T (2008) A kinematic analysis of disk motion in a double sided polisher for chemical mechanical planarization (cmp). Tribol Int 41(2):111–118

    Article  Google Scholar 

  6. Kim H, Jeong H (2004) Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization. J Electron Mater 33(1):53–60

    Article  Google Scholar 

  7. Hu Z, Fang C, Deng W, Zhao Z, Lin Y, Xu X (2017) Speed ratio optimization for ceramic lapping with fixed diamond pellets. Int J Adv Manuf Technol 90(9–12):3159–3169

    Article  Google Scholar 

  8. Wang L, Hu Z, Fang C, Yu Y, Xu X (2018) Study on the double-sided grinding of sapphire substrates with the trajectory method. Precis Eng 51:308–318

    Article  Google Scholar 

  9. Wang Q, Zhang X, Su J, Zhu W, Xi Q, Zhu X, Pei S (2015) Experimental study on chemical mechanical lapping of sic single crystal wafer. Surf Technol 44(4):137–140+146

  10. Zhang D, Li C, Jia D, Wang S, Li R, Qi X (2014) Grinding model and material removal mechanism of medical nanometer zirconia ceramics. Recent Pat Nanotechnol 8(1):2–17

    Article  Google Scholar 

  11. Jamshidi H, Budak E (2020) An analytical grinding force model based on individual grit interaction. J Mater Process Technol 283:116700

    Article  Google Scholar 

  12. Younis M, Sadek MM, El-Wardani T (1987) A new approach to development of a grinding force model. J Eng Ind 109(4):306–313

    Article  Google Scholar 

  13. Usui E (1972) Cutting and grinding. China Machine Press, Beijing

    Google Scholar 

  14. Sun J, Qin F, Chen P, An T (2016) A predictive model of grinding force in silicon wafer self-rotating grinding. International Journal of Machine Tools and Manufacture: Design, research and application 109:74–86

    Article  Google Scholar 

  15. Zhang J, Ge P, Zhang L (2007) Research on the grinding force based on the probability statistics. China Mech Eng 018(020):2399–2402

    Google Scholar 

  16. Jaeger JC (1942) Moving sources of heat and the temperature of sliding contacts. Proc R Soc 76

  17. Steffens K, König W (1983) Closed loop simulation of grinding. CIRP Ann 32(1):255–259

    Article  Google Scholar 

  18. Guo C, Malkin S (1995) Analysis of transient temperatures in grinding. J Eng Ind 117(4):571–577

    Article  Google Scholar 

  19. Rowe WB (2001) Thermal analysis of high efficiency deep grinding. Int J Mach Tools Manuf 41(1):1–19

    Article  Google Scholar 

  20. Wen LK, Lin JF (2006) General temperature rise solution for a moving plane heat source problem in surface grinding. Int J Adv Manuf Technol 31(3–4):268–277

    Google Scholar 

  21. Yan Y, Guo L, Zhang G (2012) Simulation and experimental research of temperature field in ultra-high speed grinding of metallic materials using finite element method. Machine Tool and Hydraulics 40(5):27–31+63

  22. Li HN, Axinte D (2017) On a stochastically grain-discretised model for 2d/3d temperature mapping prediction in grinding. Int J Mach Tools Manuf 116(05):60–76

    Article  Google Scholar 

  23. Deja M, Lichtschlag L, Uhlmann E (2021) Thermal and technological aspects of double face grinding of c45 carbon steel. J Manuf Process 64(7–8):1036–1046

    Article  Google Scholar 

  24. Cooper WL, Lavine AS (2000) Grinding process size effect and kinematics numerical analysis. J Manuf Sci Eng 122(1):59–69

    Article  Google Scholar 

  25. Badger JA, Torrance AA (2000) A comparison of two models to predict grinding forces from wheel surface topography. Int J Mach Tools Manuf 40(8):1099–1120

    Article  Google Scholar 

  26. Gong YD, Wang B, Wang W (2002) The simulation of grinding wheels and ground surface roughness based on virtual reality technology. J Mater Process Technol 129(1–3):123–126

    Article  Google Scholar 

  27. Tönshoff HK, Peters J, Inasaki I, Paul T (1992) Modelling and simulation of grinding processes. CIRP Ann 41(2):677–688

    Article  Google Scholar 

  28. Hokkirigawa K, Kato K (1988) An experimental and theoretical investigation of ploughing, cutting and wedge formation during abrasive wear. Tribol Int 21(1):51–57

    Article  Google Scholar 

  29. Wang D, Ge P, Bi W, Jiang J (2014) Grain trajectory and grain workpiece contact analyses for modeling of grinding force and energy partition. Int J Adv Manuf Technol 70(9–12):2111–2123

    Article  Google Scholar 

  30. Yip FC, Venart JES (1971) An elastic analysis of the deformation of rough spheres, rough cylinders and rough annuli in contact. J Phys D Appl Phys 4(10):1470

    Article  Google Scholar 

  31. Qian L, Yang L, Tian X, Long W, Tang X (2017) Research on scratching force of single diamond grain for 20crmnti. Tool Technol 51(3):22–25

    Google Scholar 

  32. Gao T, Li C, Yang M, Zhang Y, Jia D, Ding W, Debnath S, Yu T, Said Z, Wang J (2021) Mechanics analysis and predictive force models for the single-diamond grain grinding of carbon fiber reinforced polymers using cnt nano-lubricant. J Mater Process Technol 290:116976

    Article  Google Scholar 

  33. Sharp KW, Miller MH, Scattergood RO (2000) Analysis of the grain depth-of-cut in plunge grinding. Precis Eng 24(3):220–230

    Article  Google Scholar 

  34. Hahn RS (1962) On the nature of the grinding process. In Proceedings of the 3rd International Machine Tool Design & Research Conference, Manchester pp. 129–154

  35. Zhang X, Lin B, Xi H (2013) Validation of an analytical model for grinding temperatures in surface grinding by cup wheel with numerical and experimental results. Int J Heat Mass Transf 58(1–2):29–42

    Article  Google Scholar 

  36. Hou Z, He S, Li N (1984) Heat Conduced of Solid. Shanghai Science and Technology Press, Shanghai

    Google Scholar 

  37. Ruan D (1999) Heat conduction due to moving heat sources in semi-infinite body. J Chongqing Univ (Natural Science Edition) 22(1):66–71

    Google Scholar 

  38. Wang R, Dai S, Zhang H, Dong Y (2017) The temperature field study on the annular heat source model in large surface grinding by cup wheel. Int J Adv Manuf Technol 93(9):3261–3273

    Article  Google Scholar 

  39. Li Q, Xiu S, Yao Y, Sun C, Zheng S (2020) Study on surface material removal uniformity in double side grinding based on grain trajectories. Int J Adv Manuf Technol 107(5):2865–2873

    Article  Google Scholar 

Download references

Funding

This project is supported by National Natural Science Foundation of China (Grant No. 52175383 and Grant No. 51775101).

Author information

Authors and Affiliations

  1. Northeastern University, Shenyang, 110819, China

    Qingliang Li, Shichao Xiu, Cong Sun, Yunlong Yao & Xiangna Kong

Authors
  1. Qingliang Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Shichao Xiu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Cong Sun
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yunlong Yao
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Xiangna Kong
    View author publications

    You can also search for this author in PubMed Google Scholar

Contributions

Qingliang Li and Xiangna Kong proposed the ideas and established the simulation model, and Cong Sun and Yunlong Yao designed the experimental plan. The measurement was performed by Qingliang Li and Cong Sun. Qingliang Li, Yunlong Yao and Xiangna Kong processed and analyzed the experimental data. Qingliang Li wrote the original draft and Shichao Xiu supervised the project and reviewed and edited the article.

Corresponding author

Correspondence to Shichao Xiu.

Ethics declarations

Conflicts of interest

All authors certify that they have no affiliations with or involvement in any organization or entity with any financial interest or non-financial interest in the subject matter or materials discussed in this manuscript.

Ethics approval

Not applicable

Consent to participate

Not applicable

Consent for publication

Not applicable

Additional information

Publisher’s Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Li, Q., Xiu, S., Sun, C. et al. Analysis of the uniformity of material removal in double-sided grinding based on thermal–mechanical coupling. Int J Adv Manuf Technol 119, 3363–3375 (2022). https://doi.org/10.1007/s00170-021-08457-6

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-021-08457-6

Keywords

Search

Navigation