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Study on surface material removal uniformity in double side grinding based on grain trajectories

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Abstract

Double side grinding is a process with high processing efficiency in which the wheel and the workpiece are in surface contact. But the phenomenon that the workpiece surface profile is out of tolerance exists because of the material removal non-uniformity in the grinding process. In order to improve the surface integrity of the ground workpiece, the mathematical models of grinding trajectory distribution and material removal were established on the basis of the double side grinding process. The simulation and experimental research were carried out under different grinding parameters. It was shown that when the grinding wheel rotates in the co-rotation to the workpiece, the surface profile of the workpiece was better than that of the opposite direction. The speed ratio of the grinding wheel to the workpiece had a significant influence on the surface trajectory distribution and material removal uniformity. When the speed ratio was irrational, the trajectory distribution was more uniform. At a lower speed ratio, the surface profile of the workpiece was better. Although the simulation results and the experimental results had a good consistency in the trend, the simulated values were obviously smaller than the experimental values, which indicated that the material removal uniformity based on grain trajectories was not the only influencing factor of the phenomenon of convex in the middle of the workpiece during double side grinding.

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Funding

This project is supported by Fundamental Research Funds for the Central Universities (N180306003) and National Natural Science Foundation of China (Grant No. 51775101).

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Authors and Affiliations

  1. Northeastern University, Shenyang, 110819, China

    Qingliang Li, Shichao Xiu, Yunlong Yao & Cong Sun

  2. Shenyang HERMOS CNC Machine Co., LTD, Shenyang, 110179, China

    Shiguang Zheng

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  1. Qingliang Li
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  2. Shichao Xiu
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  3. Yunlong Yao
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  4. Cong Sun
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  5. Shiguang Zheng
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Correspondence to Shichao Xiu.

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Li, Q., Xiu, S., Yao, Y. et al. Study on surface material removal uniformity in double side grinding based on grain trajectories. Int J Adv Manuf Technol 107, 2865–2873 (2020). https://doi.org/10.1007/s00170-020-05147-7

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  • DOI: https://doi.org/10.1007/s00170-020-05147-7

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