Skip to main content
SpringerLink
Log in

Analysis on the removal mechanism of disc grinding based on dynamic thermal–mechanical coupling

  • Published:
International Journal of Mechanics and Materials in Design Aims and scope Submit manuscript

Abstract

Disc grinding is a commonly-utilized removal technology to generate the machining surface with higher precision. The material removal is caused by the force interaction between abrasives, which releases much heat during grinding. The dynamic thermal–mechanical coupling can be a crucial factor to influence the surface performance of the workpiece. However, previous studies on disc grinding are not enough for investigating the influence of the removal mechanism on the surface’s quality with dynamic thermal–mechanical coupling effect, which is caused by the double-side enclosed construction of grinding tool. To fill this gap, a novel coupled theoretical model is established based on effective abrasives dynamic removal. The moving trajectory of the discrete dynamic abrasives is deduced firstly. Meanwhile, the dynamic mechanical interaction is calculated by effective abrasives movements and height differences. Afterwards, the dynamic thermal relaxation is calculated by a finite difference method according to the effective abrasives moving trajectory and dynamic mechanical interactions, which is further validated by the finite element method. On account of the distribution of dynamic thermal–mechanical coupling, the uneven machining is found in disc grinding process. Furthermore, disc grinding experiments are performed to validate the analyzed regulations by the measurements of machining surface profile. The obtained findings are anticipated to be meaningful for improving disc grinding mechanism and optimization in wafer machining enterprises.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Fig. 1
Fig. 2
Fig. 3
Fig. 4
Fig. 5
Fig. 6
Fig. 7
Fig. 8
Fig. 9
Fig. 10
Fig. 11
Fig. 12
Fig. 13
Fig. 14
Fig. 15
Fig. 16
Fig. 17
Fig. 18
Fig. 19
Fig. 20
Fig. 21
Fig. 22
Fig. 23
Fig. 24
Fig. 25

Similar content being viewed by others

References

  • Afzal, A., Abdul Mujeebu, M.: Thermo-mechanical and structural performances of automobile disc brakes: a review of numerical and experimental studies. Arch. Comput. Methods Eng. 26, 1489–1513 (2019)

    Article  Google Scholar 

  • Baisie, E.A., Li, Z.C., Zhang, X.H.: Design optimization of diamond disk pad conditioners. Int. J. Adv. Manuf. Technol. 66, 2041–2052 (2013)

    Article  Google Scholar 

  • Chen, X., Wang, D., Yufan, L.: Influence of high speed grinding on surface integrity of 18CrNiMo7-6. Surf. Technol. 47, 259–265 (2018)

    Google Scholar 

  • Fang, C., Zhao, Z., Hu, Z.: Pattern optimization for phyllotactic fixed abrasive pads based on the trajectory method. IEEE Trans. Semicond. Manuf. 30, 78–85 (2017)

    Article  Google Scholar 

  • Foeckerer, T., Zaeh, M., Zhang, O.B.: A three-dimensional analytical model to predict the thermo-metallurgical effects within the surface layer during grinding and grind-hardening. Int. J. Heat Mass Transf. 56, 223–237 (2013)

    Article  Google Scholar 

  • Hocheng, H., Tsai, H.Y., Tsai, M.S.: Effects of kinematic variables on nonuniformity in chemical mechanical planarization. Int. J. Mach. Tools Manuf 40, 1651–1669 (2000)

    Article  Google Scholar 

  • Jiang, Y., Guo, Q.: Simulation of multi-axis grinding considering runout based on envelope theory. Chin. J. Aeronaut. (2020)

  • Kasai, T.: A kinematic analysis of disk motion in a double sided polisher for chemical mechanical planarization (CMP). Tribol. Int. 41, 111–118 (2008)

    Article  Google Scholar 

  • Kim, H.-M., Manivannan, R., Moon, D.-J., Xiong, H., Park, J.-G.: Evaluation of double sided lapping using a fixed abrasive pad for sapphire substrates. Wear 302, 1340–1344 (2013)

    Article  Google Scholar 

  • Li, H.N., Yang, Y., Zhao, Y.J., Zhang, Z., Zhu, W., Wang, W., Qi, H.: On the periodicity of fixed-abrasive planetary lapping based on a generic model. J. Manuf. Process. 44, 271–287 (2019)

    Article  Google Scholar 

  • Li, J., Li, J.C.M.: Temperature distribution in workpiece during scratching and grinding. Mater. Sci. Eng., A 409, 108–119 (2005)

    Article  Google Scholar 

  • Li, Y., Wu, Y., Zhou, L., Fujimoto, M.: Vibration-assisted dry polishing of fused silica using a fixed-abrasive polisher. Int. J. Mach. Tools Manuf 77, 93–102 (2014)

    Article  Google Scholar 

  • Liu, Y., Li, T.-X., Liu, K., Zhang, Y.-M.: Chatter reliability prediction of turning process system with uncertainties. Mech. Syst. Signal Process. 66–67, 232–247 (2016)

    Article  Google Scholar 

  • Liu, Y., Warkentin, A., Bauer, R., Gong, Y.: Investigation of different grain shapes and dressing to predict surface roughness in grinding using kinematic simulations. Precis. Eng. 37, 758–764 (2013)

    Article  Google Scholar 

  • Luo, Q., Lu, J., Xu, X.: Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools. Tribol. Int. 104, 191–203 (2016)

    Article  Google Scholar 

  • Lyu, Y., Yu, H., Wang, J., Chen, C., Xiang, L.: Study on the grinding temperature of the grinding wheel with an abrasive phyllotactic pattern. Int. J. Adv. Manuf. Technol. 91, 895–906 (2017)

    Article  Google Scholar 

  • Mondal, D.P., Jain, H., Das, S., Jha, A.K.: Stainless steel foams made through powder metallurgy route using NH4HCO3 as space holder. Mater. Des. 88, 430–437 (2015)

    Article  Google Scholar 

  • Ni, C., Zhu, L., Zheng, Z., Zhang, J., Yang, Y., Yang, J., Bai, Y., Weng, C., Lu, W.F., Wang, H.: Effect of material anisotropy on ultra-precision machining of Ti-6Al-4V alloy fabricated by selective laser melting. J Alloy Compd 848, 156457 (2020)

    Article  Google Scholar 

  • Nakayama, K., Hashimoto, H.: Experimental investigation of the superfinishing process. Wear 185, 173–182 (1995)

    Article  Google Scholar 

  • Ni, C., Zhu, L., Liu, C., Yang, Z.: Analytical modeling of tool-workpiece contact rate and experimental study in ultrasonic vibration-assisted milling of Ti–6Al–4V. Int. J. Mech. Sci. 142–143, 97–111 (2018)

    Article  Google Scholar 

  • Pan, J., Guo, M., Yan, Q., Zheng, K., Xiao, X.: Research on material removal model and processing parameters of cluster magnetorheological finishing with dynamic magnetic fields. Int. J. Adv. Manuf. Technol. 100, 2283–2297 (2019)

    Article  Google Scholar 

  • Pietsch, G.J., Kerstan, M.: Understanding simultaneous double-disk grinding: operation principle and material removal kinematics in silicon wafer planarization. Precis. Eng. 29, 189–196 (2005)

    Article  Google Scholar 

  • Sun, C., Yao, Y., Xiu, S.C., Yu, Z.: Influences of system chatter on the ground workpiece’s surface topography under prestress condition. Surf. Technol. 49, 326–335 (2020a)

    Google Scholar 

  • Shao, Y., Li, B., Chiang, K.N., Liang, S.Y.: Physics-based analysis of minimum quantity lubrication grinding. Int. J. Adv. Manuf. Technol. 79, 1–12 (2015)

    Article  Google Scholar 

  • Shao, Y., Liang, S.Y.: Predictive Force Modeling in MQL (minimum quantity lubrication) grinding. American Society of Mechanical Engineers, V002T002A007-V002T002A007. (2014)

  • Shen, B., Shih, A.J., Xiao, G.: A heat transfer model based on finite difference method for grinding. J. Manuf. Sci. Eng. 133, 031001 (2011)

    Article  Google Scholar 

  • Smithey, D.W., Kapoor, S.G., DeVor, R.E.: A new mechanistic model for predicting worn tool cutting forces. Mach. Sci. Technol. 5, 23–42 (2001)

    Article  Google Scholar 

  • Sun, C., Duan, J., Lan, D., Liu, Z., Xiu, S.: Prediction about ground hardening layers distribution on grinding chatter by contact stiffness. Arch. Civ. Mech. Eng. 18, 1626–1642 (2018)

    Article  Google Scholar 

  • Sun, C., Xiu, S., Hong, Y., Kong, X., Lu, Y.: Prediction on residual stress with mechanical-thermal and transformation coupled in DGH. Int. J. Mech. Sci. 179, 105629 (2020b)

    Article  Google Scholar 

  • Sun, J., Qin, F., Chen, P., An, T.: A predictive model of grinding force in silicon wafer self-rotating grinding. Int. J. Mach. Tools Manuf 109, 74–86 (2016)

    Article  Google Scholar 

  • Tang, J., Du, J., Chen, Y.: Modeling and experimental study of grinding forces in surface grinding. J. Mater. Process. Technol. 209, 2847–2854 (2009)

    Article  Google Scholar 

  • Uhlmann, E., Hoghé, T., Kleinschnitker, M.: Grinding wheel wear prediction at double face grinding with planetary kinematics using analytic simulation. Int. J. Adv. Manuf. Technol. 69, 2315–2321 (2013)

    Article  Google Scholar 

  • Wang, L., Hu, Z., Fang, C., Yu, Y., Xu, X.: Study on the double-sided grinding of sapphire substrates with the trajectory method. Precision Engineering 51 (2017)

  • Werner, G.: Influence of work material on grinding forces. Gen Assem of CIRP, 28th. Manuf Technol 27, 243–248 (1978)

    Google Scholar 

  • Xiu, S., Sun, C., Duan, J., Lan, D., Li, Q.: Study on the surface topography in consideration of the dynamic grinding hardening process. Int. J. Adv. Manuf. Technol. 100(1–4), 209–223 (2019)

    Article  Google Scholar 

  • Yang, J.S., Zhu, X.L., Dong, Z.G., Kang, R.K., Guo, D.M., Zhang, B.: Design of double-sided polishing machine for functional crystal substrate. Adv. Mater. Res. 1017, 580–585 (2014)

    Article  Google Scholar 

  • Zhang, X., Yu, T., Zhao, J.: An analytical approach on stochastic model for cutting force prediction in milling ceramic matrix composites. Int. J. Mech. Sci. 168, 105314 (2020)

    Article  Google Scholar 

  • Zhang, Z., Huang, S., Wang, S., Wang, B., Bai, Q., Zhang, B., Kang, R., Guo, D.: A novel approach of high-performance grinding using developed diamond wheels. Int. J. Adv. Manuf. Technol. 91, 3315–3326 (2017)

    Article  Google Scholar 

  • Zhang, Z., Song, Y., Xu, C., Guo, D.: A novel model for undeformed nanometer chips of soft-brittle HgCdTe films induced by ultrafine diamond grits. Scripta Mater. 67, 197–200 (2012)

    Article  Google Scholar 

  • Zhao, D., Wang, T., He, Y., Lu, X.: Kinematic optimization for chemical mechanical polishing based on statistical analysis of particle trajectories. IEEE Trans. Semicond. Manuf. 26, 556–563 (2013)

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. School of Mechanical Engineering and Automation, Northeastern University, Shenyang, 110819, People’s Republic of China

    Cong Sun, Yue Lu, Shichao Xiu, Qingliang Li & Peng Zhang

Authors
  1. Cong Sun
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Yue Lu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Shichao Xiu
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Qingliang Li
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Peng Zhang
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Shichao Xiu.

Additional information

Publisher's Note

Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Sun, C., Lu, Y., Xiu, S. et al. Analysis on the removal mechanism of disc grinding based on dynamic thermal–mechanical coupling. Int J Mech Mater Des 17, 831–853 (2021). https://doi.org/10.1007/s10999-021-09539-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10999-021-09539-9

Keywords

Search

Navigation