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Investigation on the influence of material crystallographic orientation on grinding force in the micro-grinding of single-crystal copper with single grit

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Abstract

In the micro-grinding process, owing to the size effect, the effects of material microstructure on the grinding force are more significant through the variation of material flow stress. Currently, the variation of material flow stress resulting from the change of crystallographic orientation during the micro-grinding has not been well examined. In this paper, a new predictive model for the variation of flow stress due to the process-induced change of crystallographic orientation is developed, which is based on the Taylor factor as determined by calculating the activated slip systems, thus quantifying the way crystallographic orientation affects both the number and the style of activated slip systems. Moreover, the predicted force is compared with previous reported experimental data on monocrystalline copper. As a result, the following findings are obtained from the comparison between the predicted result and the experimental data: (1) The predicted microgrinding force agrees well in trend with the experimental force, suggesting that the approach for predicting the grinding force based on the Taylor factor is feasible; (2) In the microgrinding of single-crystal materials, the feed rate direction relative to the crystallographic orientation has great effects on the flow stress and hence on the grinding force.

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Authors and Affiliations

  1. Donghua University, 2999 North Renmin Road, Songjiang district, Shanghai, 201620, China

    Man Zhao, Xia Ji & Beizhi Li

  2. Georgia Institute of Technology, 801 Ferst Drive, Atlanta, GA, 30332, USA

    Steven Y. Liang

Authors
  1. Man Zhao
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  2. Xia Ji
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  3. Beizhi Li
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  4. Steven Y. Liang
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Correspondence to Xia Ji.

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Zhao, M., Ji, X., Li, B. et al. Investigation on the influence of material crystallographic orientation on grinding force in the micro-grinding of single-crystal copper with single grit. Int J Adv Manuf Technol 90, 3347–3355 (2017). https://doi.org/10.1007/s00170-016-9605-1

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  • DOI: https://doi.org/10.1007/s00170-016-9605-1

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