Skip to main content

Advertisement

SpringerLink
Log in

Pressure-sensitive fasteners for active disassembly

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

This paper presents a number of novel active fasteners developed to significantly lower disassembly costs during reconditioning, remanufacturing, and recycling of products. In the initial stage of the fastener development process, the applicability of distinct trigger signals for active disassembly (AD) is evaluated. Based on this evaluation, the high robustness of using a pressure increase or decrease as a nondestructive trigger for AD is demonstrated. Since previously proposed pressure-sensitive fasteners face considerable drawbacks upon implementation in electronic products due to the ongoing trend of miniaturization, a second generation of pressure-based active fasteners is developed. Evaluation of these fasteners by means of axiomatic design techniques and prototyping demonstrates that the presented snap-fits, which make use of a closed-cell elastomer foam, are most robust. Subsequently, the contraction forces that closed-celled foams can exert as a function of an increase in ambient air pressure are experimentally determined. Furthermore, the implementation of pressure-sensitive foam-based snap-fits in both a modem and a payment terminal is described. Results of these experiments demonstrate that the contraction force of a cross-linked metallocene polyethylene closed-cell foams can reach up to 6 N/cm2 at an overpressure of 2 bar and that the foam-based snap-fits can be released at a pressure increase of 2 bar.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Umeda Y, Takata S, Kimura F, Tomiyama T, Sutherland JW, Kara S, Herrmann C, Duflou JR (2012) Toward integrated product and process life cycle planning—an environmental perspective. CIRP Ann Manuf Technol 61(2):681–702. doi:10.1016/j.cirp.2012.05.004

    Article  Google Scholar 

  2. Boothroyd G, Alting L (1992) Design for assembly and disassembly. CIRP Ann Manuf Technol 41(2):625–636. doi:10.1016/S0007-8506(07)63249-1

    Article  Google Scholar 

  3. Alting DL, Jøgensen DJ (1993) The life cycle concept as a basis for sustainable industrial production. CIRP Ann Manuf Technol 42(1):163–167. doi:10.1016/S0007-8506(07)62417-2

    Article  Google Scholar 

  4. Sundin E Product and process design for successful remanufacturing, 2004 Linköpings Universitet

  5. Yang SS, Ong SK, Nee AYC (2014) EOL strategy planning for components of returned products. Int J Adv Manufac Technol: 1–13. doi:10.1007/s00170-014-6505-0

  6. Yang Q, Yu S, Sekhari A (2011) A modular eco-design method for life cycle engineering based on redesign risk control. Int J Adv Manuf Technol 56(9–12):1215–1233. doi:10.1007/s00170-011-3246-1

    Article  Google Scholar 

  7. Meskers C, Hagelüken C, Salhofer S (2009) Impact of pre-processing routes on precious metal recovery from PCs. Paper presented at the European Metallurgical Conference (EMC) Innsbruck, Austria

  8. Peeters JR, Vanegas P, Tange L, Van Houwelingen J, Duflou JR (2013) Closed loop recycling of plastics containing flame retardants. Res Conserv Recyc 84:36–43

    Google Scholar 

  9. Peeters JR, Vanegas P, Duflou JR, Mizunoc T, Fukushigec S, Umeda Y (2013) Effects of boundary conditions on the end-of-life treatment of LCD TVs. CIRP Ann Manufac Technol 62(1):35–38

    Article  Google Scholar 

  10. Willems B, Dewulf W, Duflou J (2005) Design for active disassembly (DfAD)—an outline for future research. Paper presented at the IEEE International Symposium on Electronics & the Environment

  11. Duflou JR, Willems B, Dewulf W (2006) Towards self-disassembling products—design solutions for economically feasible large-scale disassembly. Innovation in Life Cycle Engineering and Sustainable Development: 87–110

  12. Boothroyd G (1987) Design for assembly—the key to design for manufacture. Int J Adv Manuf Technol 2(3):3–11. doi:10.1007/bf02601481

    Article  Google Scholar 

  13. Chang T-R, Wang C-S, Wang C-C (2013) A systematic approach for green design in modular product development. Int J Adv Manuf Technol 68(9–12):2729–2741. doi:10.1007/s00170-013-4865-5

    Article  Google Scholar 

  14. Seliger G, Basdere B, Keil T, Rebafka U (2002) Innovative processes and tools for disassembly. CIRP Ann Manuf Technol 51(1):37–40. doi:10.1016/S0007-8506(07)61460-7

    Article  Google Scholar 

  15. Torres F (2004) Automatic PC disassembly for component recovery. Int J Adv Manuf Technol 23(1–2):39

    Article  Google Scholar 

  16. Kim HJ, Kernbaum S, Seliger G (2009) Emulation-based control of a disassembly system for LCD monitors. Int J Adv Manuf Technol 40(3/4):383–392. doi:10.1007/s00170-007-1334-z

    Article  Google Scholar 

  17. Basdere B (2003) Disassembly factories for electrical and electronic products to recover resources in product and material cycles. Environ Sci Technol 37(23):5354

    Article  Google Scholar 

  18. Kopacek P, Kopacek B (2006) Intelligent, flexible disassembly. Int J Adv Manuf Technol 30(5–6):554–560. doi:10.1007/s00170-005-0042-9

    Article  Google Scholar 

  19. Schumacher P, Jouaneh M (2013) A system for automated disassembly of snap-fit covers. Int J Adv Manuf Technol 69(9–12):2055–2069. doi:10.1007/s00170-013-5174-8

    Article  Google Scholar 

  20. Duflou JR, Seliger G, Kara S, Umeda Y, Ometto A, Willems B (2008) Efficiency and feasibility of product disassembly: a case-based study. CIRP Ann Manuf Technol 57(2):583–600. doi:10.1016/j.cirp.2008.09.009

    Article  Google Scholar 

  21. Merdan M, Lepuschitz W, Meurer T, Vincze M Towards ontology-based automated disassembly systems. In: IECON 2010-36th Annual Conference on IEEE Industrial Electronics Society, 7–10 Nov. 2010. pp 1392–1397

  22. Weigl-Seitz A, Hohm K, Seitz M, Tolle H (2006) On strategies and solutions for automated disassembly of electronic devices. Int J Adv Manuf Technol 30(5–6):561–573. doi:10.1007/s00170-005-0043-8

    Article  Google Scholar 

  23. Lee SG, Lye SW, Khoo MK (2001) A multi-objective methodology for evaluating product end-of-life options and disassembly. Int J Adv Manuf Technol 18(2):148–156. doi:10.1007/s001700170086

    Article  Google Scholar 

  24. Pretsch T (2010) Review on the functional determinants and durability of shape memory polymers. J Polym 2(3):120

    Article  Google Scholar 

  25. Willems B (2007) Doctoral dissertation: development of improved fastening techniques in support of design for disassembly strategies. KU Leuven, Leuven, ISBN: 978-90-5682-822-6

  26. Tesla N, James Clerk M (2011) Wireless power transfer technology and EV application

  27. Chiodo JD, Billett EH, Harrison DJ (1999) Active disassembly using shape memory polymers for the mobile phone industry. Ieee Int Symp Electr 151–156:344

    Google Scholar 

  28. Chiodo JD, Harrison DJ, Billett EH (2001) An initial investigation into active disassembly using shape memory polymers. P I Mech Eng B-J Eng 215(5):733–741

    Google Scholar 

  29. Chiodo JD, McLaren J, Billett EH, Harrison DJ Isolating LCD’s at end-of-life using active disassembly technology: a feasibility study. In: Proceedings of the 2000 Ieee International Symposium on Electronics and the Environment, 2000. pp 318–323, 359

  30. Chiodo JD, Billett EH, Harrison DJ Preliminary investigations of active disassembly using shape memory polymers. In: First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, 1999. pp 590–596, 1021

  31. Chiodo JD, Jones N, Billett EH, Harrison DJ (2002) Shape memory alloy actuators for active disassembly using ‘smart’ materials of consumer electronic products. Mater Des 23(5):471–478

    Article  Google Scholar 

  32. Nick Jones DH, Hussein H, Billett E, Chiodo J (2003) Towards self-disassembling vehicles. J Sustain Prod Des 3(1):59–74

    Article  Google Scholar 

  33. Arnaiz S, Bodenhoefer K, Harrison D, Herrmann C, Hussein H, Irasarri L, Malaina M, Schnecke D, Tanskanen P (2004) ‘Active disassembly using Smart Materials’ End of Life technology for WEEE—results from the framework V project. Electronics Goes Green 2004 (Plus): driving forces for future electronics, Proceedings: 275–280, 1092

  34. Bain P, Manfre G (2006) Method and apparatus for bonding and debonding adhesive interface surfaces. US Patent

  35. Cingil HE (2010) Conducting polymer-coated thermally expandable microspheres. Polym Chem 1(8):1323

    Article  Google Scholar 

  36. Carrell J (2010) Robust analysis of the active disassembly process. Paper presented at the IEEE International Symposium on Sustainable Systems and Technology

  37. Kurs A (2007) Wireless power transfer via strongly coupled magnetic resonances. J Sci 317(5834):83

    Article  MathSciNet  Google Scholar 

  38. Willems B (2007) Development of improved fastening techniques in support of design for disassembly strategies. Katholieke Universiteit Leuven, Leuven

    Google Scholar 

  39. Savransky SD (2000) Engineering of creativity: introduction to Triz methodology of inventive problem solving. CRC Press, Boca Raton

    Book  Google Scholar 

  40. Prokhorov AM (1970) Great Soviet Encyclopedia

  41. Pugliesi-Conti J, Girardiere C (1990) Snap-fit device for joining two parts together US005102253A

  42. Kott N (2003) Fastener system. US2003/0044229

  43. Willems B, Dewulf W, Duflou JR (2007) Active snap-fit development using topology optimization. Int J Prod Res 45(18–19):4163–4187. doi:10.1080/00207540701440311

    Article  MATH  Google Scholar 

  44. Willems B, Dewulf W, Duflou JR (2007) Pressure-triggered active fasteners: design results using topology optimization. Proceed 2007 I.E. Int Sympos Electron Environ, Conf Rec 184–189:262

    Google Scholar 

  45. Van Horenbeek A, Albert-Nagy A (2009) Pressure-based fastener optimization and implementation in a Philips flat screen TV. KU Leuven, Leuven

    Google Scholar 

  46. Neubert H (2000) Simultan lösbare Verbindungen zur Rationalisierung der Demontage in der Feinwerktechnik. Technical University of Dresden

  47. Peeters JR, Van den Bossche W, Devolder T, Dewulf W, Duflou JR (2014) Second generation of pressure sensitive fasteners for active disassembly. Paper presented at the 21st CIRP Conference on Life Cycle Engineering, Norway, Trondheim

  48. Suh NP (1998) Axiomatic design theory for systems. Res Eng Des 10(4):189–209

    Article  Google Scholar 

  49. CeraCon (2013) S-FIT® (Soft foam injection technology). http://www.ceracon.com/

Download references

Author information

Authors and Affiliations

  1. Mechanical Engineering Department, KU Leuven, Celestijnenlaan 300A, Box 2422, 3001, Leuven, Belgium

    Jef R. Peeters, Wannes Van den Bossche, Paul Vanegas, Wim Dewulf & Joost R. Duflou

  2. TP Vision, Technologiepark-Zwijnaarde 19, 9052, Ghent, Belgium

    Tom Devoldere

Authors
  1. Jef R. Peeters
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Wannes Van den Bossche
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Tom Devoldere
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Paul Vanegas
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Wim Dewulf
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Joost R. Duflou
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Jef R. Peeters.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Peeters, J.R., Van den Bossche, W., Devoldere, T. et al. Pressure-sensitive fasteners for active disassembly. Int J Adv Manuf Technol 87, 1519–1529 (2016). https://doi.org/10.1007/s00170-015-7168-1

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-015-7168-1

Keywords

Search

Navigation