Skip to main content
SpringerLink
Log in

Optimization of the chemical mechanical polishing process for optical silicon substrates

  • ORIGINAL ARTICLE
  • Published:
The International Journal of Advanced Manufacturing Technology Aims and scope Submit manuscript

Abstract

Chemical mechanical polishing (CMP) experiments are performed to study the effects of four key process factors on the flatness and surface finish of the polished optical silicon substrates and on the material removal rate (MRR). The experimental results and analyses reveal that the pad rotational speed and polish pressure have significant effects on the MRR, the interaction of the polish head rotational speed and slurry supply velocity and the interaction of the polish pressure and polish head rotational speed have significant effects on the flatness, and the pad rotational speed has a significant effect on the surface roughness R t of the optical silicon substrates polished. The optimal combination of the four factors investigated is a polish pressure of 9,800 Pa, a pad rotational speed of 20 rpm, a polish head rotational speed of 20 rpm, and a slurry supply velocity of 100 ml/min. A confirmation CMP experiment has been carried out using the optimal process parameter setting obtained from the design of experiments analyses. The goal to attain optical silicon substrates with nanometric surface roughness and micrometric flatness by an optimized CMP process with a high MRR simultaneously so as to reduce the polishing time to only 15 min from over 8 h has been achieved.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Arif M, Rahman M, San WY (2011) Analytical modeling of ductile-regime machining of tungsten carbide by endmilling. Int J Adv Manuf Technol 55(1–4):53–64

    Article  Google Scholar 

  2. Arif M, Rahman M, San WY, Doshi N (2011) An experimental approach to study the capability of end-milling for microcutting of glass. Int J Adv Manuf Technol 53(9–12):1063–1073

    Article  Google Scholar 

  3. Zhong ZW, Nakagawa T (1992) Development of a micro-displacement table for ultra-precision machining and grinding for curved surfaces by the use of it. Int J Jpn Soc Precis Eng 26(2):102–107

    Google Scholar 

  4. Demirci I, Mezghani S, Mkaddem A, El Mansori M (2010) Effects of abrasive tools on surface finishing under brittle-ductile grinding regimes when manufacturing glass. J Mater Process Technol 210(3):466–473

    Article  Google Scholar 

  5. Zhong ZW, Venkatesh VC (2009) Recent developments in grinding of advanced materials. Int J Adv Manuf Technol 41(5–6):468–480

    Article  Google Scholar 

  6. Giridhar D, Vijayaraghavan L, Krishnamurthy R (2010) Micro-grooving studies on alumina ceramic material. Mater Manuf Process 25(10):1148–1159

    Article  Google Scholar 

  7. Zhong ZW (2003) Ductile or partial ductile mode machining of brittle materials. Int J Adv Manuf Technol 21(8):579–585

    Article  Google Scholar 

  8. Zhong ZW (2002) Surface finish of precision machined advanced materials. J Mater Process Technol 122(2–3):173–178

    Article  Google Scholar 

  9. Sura E, Mansori ME, Ghidossi P, Deblaise S, Negro TD, Khanfir H (2007) An energy analysis of belt polishing process and its applications to time cycle and tracking effects. Mach Sci Technol 11(2):217–234

    Article  Google Scholar 

  10. Horng TL (2007) A model to simulate surface roughness in the pad dressing process. J Mech Sci Technol 21(10):1599–1604

    Article  Google Scholar 

  11. Mohan R, Babu NR (2010) Experimental investigations on ice bonded abrasive polishing of copper materials. Mater Manuf Process 25(12):1462–1469

    Article  Google Scholar 

  12. Wang K, Kang RK, Jin ZJ, Wang NH (2007) An experimental study of the polishing process for MgO single crystal substrate. Key Eng Mater 329:225–230

    Article  Google Scholar 

  13. Liao HT, Shie JR, Yang YK (2008) Applications of Taguchi and design of experiments methods in optimization of chemical mechanical polishing process parameters. Int J Adv Manuf Technol 38(7–8):674–682

    Article  Google Scholar 

  14. Pa PS (2009) Design of UAPEF super finish module on ZDC2 surface. Mater Manuf Process 24(12):1479–1486

    Article  Google Scholar 

  15. Hung CL, Ku WL, Yang LD (2010) Prediction system of magnetic abrasive finishing (MAF) on the internal surface of a cylindrical tube. Mater Manuf Process 25(12):1404–1412

    Article  Google Scholar 

  16. Reddy ES, Patil NP, Guttal SS, Jagadish HG (2007) Effect of different finishing and polishing agents on the surface roughness of cast pure titanium. J Prosthodont 16(4):263–268

    Article  Google Scholar 

  17. Mirian SS, Fadaei A, Safavi SM, Farzin M, Salimi M (2011) Improving the quality of surface in the polishing process with the magnetic abrasive powder polishing using a high-frequency induction heating source on CNC table. Int J Adv Manuf Technol 55(5–8):601–610

    Article  Google Scholar 

  18. Zhan JM, Yu SH (2011) Study on error compensation of machining force in aspheric surfaces polishing by profile-adaptive hybrid movement-force control. Int J Adv Manuf Technol 54(9–12):879–885

    Article  Google Scholar 

  19. Sidpara A, Jain VK (2011) Effect of fluid composition on nanofinishing of single-crystal silicon by magnetic field-assisted finishing process. Int J Adv Manuf Technol 55(1–4):243–252

    Article  Google Scholar 

  20. Vallin O, Danielsson R, Lindberg U, Thornell G (2007) Polishing of quartz by rapid etching in ammonium bifluoride. IEEE Trans Ultrason Ferroelectr Freq Control 54(7):1454–1462

    Article  Google Scholar 

  21. Chou WC, Chao CL, Chien HH, Ma KJ, Lin HY (2007) Investigation of thermo-chemical polishing of CVD diamond film. Key Eng Mater 329:195–200

    Article  Google Scholar 

  22. Ramesh K, Lewis WG, Yin L, Zhou FF (2007) Linear grinding of microbores using diamond-adhered wire. Mater Manuf Process 22(2):271–276

    Article  Google Scholar 

  23. Sarac YS, Elekdag-Turk S, Sarac D, Turk T (2007) Surface conditioning methods and polishing techniques effect on surface roughness of a feldspar ceramic. Angle Orthod 77(4):723–728

    Article  Google Scholar 

  24. Zhong ZW, Wang ZF, Tan YH (2006) Chemical mechanical polishing of polymeric materials for MEMS applications. Microelectron J 37(4):295–301

    Article  Google Scholar 

  25. Tsai HJ, Huang PY, Tsai HC, Chiu SJ (2011) Chemical mechanical polishing in elastic contact and partial hydrodynamic lubrication: modeling and experiments. Mater Manuf Process 26(2):319–324

    Article  Google Scholar 

  26. Villeneuve C, Pons P, Puyal V, Plana R (2010) Planarization optimization of RF-MEMS switches with a gold membrane. J Micromech Microeng 20(6):064013

    Article  Google Scholar 

  27. Zhong ZW, Wang ZF, Zirajutheen BMP, Tan YS, Tan YH (2007) Polishing of poly(methyl methacrylate), polycarbonate, and SU-8 polymers. Mater Sci-Poland 25(1):103–112

    Google Scholar 

  28. Tsai MY, Chen WK (2011) Effect of CMP conditioner diamond shape on pad topography and oxide wafer performances. Int J Adv Manuf Technol 55(1–4):253–262

    Article  Google Scholar 

  29. Rashad MM, Hessien MM, Abdel-Aal EA, El-Barawy K, Singh RK (2011) Transformation of silica fume into chemical mechanical polishing (CMP) nano-slurries for advanced semiconductor manufacturing. Powder Technol 205(1–3):149–154

    Article  Google Scholar 

  30. Zhong ZW (2008) Recent advances in polishing of advanced materials. Mater Manuf Process 23(5):449–456

    Article  Google Scholar 

  31. Möllers I, Jäger D, Gaudino R, Nocivelli A, Kragl H, Ziemann O, Weber N, Koonen T, Lezzi C, Bluschke A, Randel S (2009) Plastic optical fiber technology for reliable home networking: overview and results of the EU project POF-ALL. IEEE Commun Mag 47(8):58–68, Topics in Optical Communications

    Article  Google Scholar 

  32. Yin A, Li L, Zhang X (2010) Analysis of modulation format in the 40 Gbit/s optical communication system. Optik 121(17):1550–1557

    Article  Google Scholar 

  33. Sugawara T, Makio S (2006) Demonstration of 40-Gb/s low-group-delay-ripple tunable dispersion compensator using angled etalon with multiple reflections. IEEE Photonic Technol Lett 18(22):2377–2379

    Article  Google Scholar 

  34. Tokle T, Peucheret C, Jeppesen P (2003) Advanced modulation formats in 40 Gbit/s optical communication systems with 80 km fibre spans. Optics Commun 225(1–3):79–87

    Article  Google Scholar 

  35. Ike Y, Tsukada S, Kojima S (2007) High-resolution Brillouin spectroscopy with angular dispersion-type Fabry-Perot interferometer and its application to a quartz crystal. Rev Sci Instrum 78(7):076104

    Article  Google Scholar 

  36. Liu J, Michel J, Cannon DD, Giziewicz W, Pan D, Danielson DT, Jongthammanurak S, Yasaitis J, Wada K, Fonstad CG, Kimerling LC (2004) High speed Ge photodetectors on Si platform for GHz optical communications in C + L bands. Symposium on Progress in Compound Semiconductor Materials IV, Boston, MA, pp. 285–289

  37. Zhong ZW, Wang ZF, Zirajutheen BMP (2005) Chemical mechanical polishing of polycarbonate and poly methyl methacrylate substrates. Microelectronic Eng 81(1):117–124

    Article  Google Scholar 

Download references

Acknowledgments

The authors would like to thank Mr. Ng Seow Tong of Singapore Institute of Manufacturing Technology and Mr. Xu Hao of Nanyang Technological University for their experimental assistance.

Author information

Authors and Affiliations

  1. School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore, 639798, Republic of Singapore

    Z. W. Zhong

  2. Singapore Institute of Manufacturing Technology, 71 Nanyang Drive, Singapore, 638075, Republic of Singapore

    Y. B. Tian, Y. J. Ang & H. Wu

Authors
  1. Z. W. Zhong
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Y. B. Tian
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Y. J. Ang
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. H. Wu
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Z. W. Zhong.

Rights and permissions

Reprints and permissions

About this article

Cite this article

Zhong, Z.W., Tian, Y.B., Ang, Y.J. et al. Optimization of the chemical mechanical polishing process for optical silicon substrates. Int J Adv Manuf Technol 60, 1197–1206 (2012). https://doi.org/10.1007/s00170-011-3668-9

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s00170-011-3668-9

Keywords

Search

Navigation