Abstract
As multichip modules (MCMs) grow in chip count and complexity, increasingly large numbers of input/output (I/O) channels will be required for connection to other MCMs or printed wiring boards. In applications such as digital signal processing, large increases in processing density (number of operations in a given volume) can be obtained in stacked MCM arrangements. The potential pin counts and required I/O densities in these stacked architectures will push beyond the limits of present interlevel coupling techniques. This problem is particularly acute if easy separation of layers is needed to meet MCM testing and yield requirements. Solutions to this problem include the use of laser-drilled, metal-filled electrical vias in the MCM substrate and also optoelectronic data channels that operate in large arrays. These arrays will emit and detect signals traveling perpendicular to the surface of the MCM. All of these approaches will require packaging and alignment that makes use of advanced MCM manufacturing techniques.
This is a preview of subscription content, log in via an institution to check access.
Similar content being viewed by others
References
“National Technology Road Map for Semiconductors” SI A Semiconductor Workshop—Working Group Reports and Workshop Conclusions (Santa Clara, CA: Semiconductor Industry Association, 1993).
T.J. Moravec, R.C. Eden, and D.A. Schaefer, “The Use of Diamond Substrates for Implementing 3-D MCMs,” Proceedings of the SPIE, vol. 1986(1993), pp. 86–91.
D.G. Grabbe, R.J. Pryputniewicz, and H. Merkelo, “The AMPSTAR Connector Project,” Proceedings of the SPIE, vol. 1986 (1993), pp. 347–357.
M. Alder, “GE High Density Interconnect: A Solution to the System Interconnect Problem,” Proceedings of the SPIE, vol. 1390 (1990), pp. 504–508.
M. Gdula, W.P. Kornrumpf, and B.K. Gilbert, “An Overlay Interconnect Technology for lGHz and Above MCMs,” Proc. of the 1992 IEEE Multi-Chip Module Conference MCMC-92 (New York: IEEE, 1992), pp. 171–174.
T. Sudo, “Silicon-on-Silicon Technology for CMOS-Based Computer Systems,” Proc. of the 1992 IEEE Multi-Chip Module Conference MCMC-92 (New York: IEEE, 1992), pp. 8–11.
R.A. Gassman, internal communication.
D.Z. Tsang and T.J. Goblick, “Free-Space Optical Interconnections for Parallel Computers,” Workshop Report from the IEEE Workshop on Packaging, Interconnects, Optoelectronics for the Design of Parallel Computers (New York: IEEE, 1992), pp. 56–60.
JA. Neff, “Holographic Optical Interconnections in the 3-D Computer,” Workshop Report from the IEEE Workshop on Packaging, Interconnects, Optoelectronics for the Design of Parallel Computers (New York: IEEE, 1992), pp. 61–65.
K.L. Lear and S.A. Chalmers, “High Single-Mode Power Conversion Efficiency Vertical-Cavity Top-Surface-Emitting Lasers,” IEEE Photonics Technology Letters, 5(9) (September 1993), pp. 972–975.
R.P. Schneider et al., “Efficient Room-Temperature Continuous-Wave AlGalnP/AlGaAs Visible (670 nm) Vertical-Cavity Surface-Emitting Laser Diodes,” to appear in IEEE Photonics Technology Letters, 6(3) (March 1994).
J.E. Childers, J.E. Morris, and M.R. Feldman, “CMOS Compatible Photodetectors for Optical Interconnects,” Pro-ceedings of the SPIE, 1849 (1993), pp. 292–297.
D.M. Kuchta et al., “Performance of Fiber Optic Data Links Using 670 nm CW VCSELs,” 2994 IEEE/OSA Optical Fibers Conference (OFC) Conference Digest (1994), pp. 82–83.
K. Rastanietal., “Integration of Planar Fresnel Microlenses with Vertical-Cavity Surface-Emitting Laser Arrays,” Optics Lett. 16(12) (1991), pp. 919–921.
J.E. Morris et al., “Prototype Optically Interconnected Multichip Module based on Computer Generated Hologram Technology,” Proc. of the SPIE, 1849 (1993), pp. 48–53.
K.P. Jackson, “High-Density, Array, Optical Interconnects for Multi-Chip Modules,” Proc. of the 1992 IEEE Multi-Chip Module Conf. MCMC-92 (March 1992), pp. 142–144.
M.L. Lovejoy and B.H. Rose, internal communication.
Author information
Authors and Affiliations
Rights and permissions
About this article
Cite this article
Carson, R.F., Seigal, P.K., Craft, D.C. et al. Future manufacturing techniques for stacked MCM interconnections. JOM 46, 51–55 (1994). https://doi.org/10.1007/BF03220722
Issue Date:
DOI: https://doi.org/10.1007/BF03220722