Abstract
3D integrated vertical interconnection technology is an effective way to realize miniaturization, lightweight and high integration of electronic RF system. This paper introduces and verifies a hybrid interconnection structure that combines multiple types of chip stacking and flip chip welding in detail. The vertical interconnection of multiple types of chips and substrates is realized through two assembly methods of lead bonding and flip chip bonding. Finally, multiple active chips and passive devices are high-density integrated in a 60 mm × 60 mm × 1.5 mm active link volume. Compared with the traditional 2D packaging structure, the hybrid interconnection structure can reduce the packaging volume by more than 40% and increase the interconnection density by more than 2 times, effectively meeting the target requirements of miniaturization, functional diversification and rapid response of electronic system equipment.
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Yang, C., Zhu, Z., Hu, M., Zhao, C., Long, X. (2024). Multi-Chip 3D Integrated Micro-System Based on Microwave Multilayer. In: Li, S. (eds) Computational and Experimental Simulations in Engineering. ICCES 2023. Mechanisms and Machine Science, vol 146. Springer, Cham. https://doi.org/10.1007/978-3-031-44947-5_95
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DOI: https://doi.org/10.1007/978-3-031-44947-5_95
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