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Matrix behavior in copper-tungsten composites at small strains

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Abstract

Composites with up to 15 pct tungsten wires in a copper crystal matrix prepared by infiltration showed matrix microyield and flow stresses increasing with fiber fraction. Dislocation etch-pit observations showed that the walls of a cell structure in the matrix formed during fabrication were the operative dislocation obstacles and that this initial structure rather than fiber-matrix interaction during straining was responsible for the matrix strengthening.

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Chawla, K.K., Metzger, M. Matrix behavior in copper-tungsten composites at small strains. Metall Trans A 8, 1681–1687 (1977). https://doi.org/10.1007/BF02646870

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