Abstract
Thin films of silicon oxynitride with diverse compositions were prepared by de-magnetron sputtering of silicon, utilising oxygen and nitrogen gas flows and the sputtering power to vary the composition. In order to investigate the composition of these films, a method of analysis by electron probe micro analysis with energy dispersive detection was developed and the figures of merit were compared to the wavelength dispersive method used by other authors. The precision and repeatability of the results are evaluated and the accuracy is checked by comparison with Rutherford backscattering and nuclear reaction analysis. Energy dispersive X-ray spectrometry was proven to be applicable to analyse silicon oxynitride films of any composition yielding quantitative results for nitrogen and oxygen as well as silicon. Besides the good analytical performance, electron probe micro analysis with energy dispersive X-ray spectrometry has turned out to be a non-destructive, quick, easy to use and cost effective tool for the routine analysis of light elements in thin films.
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N. Shibata,Electronics and Communications in Japan, part 2 1992,75, 84.
S. C. Bayliss, S. J. Gurman,J. Physic., Condensed Matter,1994,6, 4961.
T. Ogawa, H. Nakano, T. Gocho, T. Tsumori,Proc. SPIE 1994,2197, 722.
S. Lim, J. H. Ryu, J. F. Wager, L. M. Casas,Thin Solid Films 1993,236, 64.
M. D. Diatezua, P. A. Thiry, R. Caudano,Vacuum 1995,46, 1121.
M. D. Diatezua, A. Dereux, A. Ronda, J. P. Vigneron, Ph. Lambin, R. Caudano,Proc. SPIE 1989,1149 (Opt. Mater. Technol. Energy Effic. Sol. Energy Convers. 8), 80.
J. A. Underhill, V. S. Nguyen, M. Kerbaugh, D. Sundling,Proc. SPIE 1985,539 (Adv. Resist Technol. Processing 2), 83.
A. Hashimoto, M. Kobayashi,OKI Techn. Rev. 1986,52, 49.
A. Hashimoto, M. Kobayashi, T. Kamijoh, H. Takano, M. Sakuta,J. Electrochem. Soc. 1986,133, 1464.
M. Vogt, R. Hauptmann,Surf. Coat. Technol. 1995,74–75, 676.
J. A. Nemetz, R. E. Tressler,Solid State Technology 1983,26, 79.
J. A. Nemetz, R. E. Tressler,Solid State Technology 1983,26, 209.
M. Bhat, G. W. Yoon, J. Kim, L. K. Han, J. Yan, D. Wristers, D. L. Kwong.Proc. Electrochem. Soc. 1994,94–16 (Proceedings of the Third Symposium on Silicon Nitride and Silicon Dioxide Thin Insulating Films), 317.
C. G. Sodini, K. S. Krisch,Proceedings of the IEEE International Electron Device Meeting, 1992, p. 617.
L. K. Han, M. Bhat, D. Wristers, H. H. Wang, D. L. Kwong,Microelectron. Eng. 1995,28, 89.
R. K. Pancholy, F. M. Erdmann,IEEE Transactions on Nuclear Science,1983,NS 30, 4141.
V. J. Kapoor,Proc. Electrochem. Soc. 1989,89–7 (Proc. Symp. Silicon Nitride Silicon Dioxide Thin Insul. Films, 1988), 19.
M. Wittmer,J. Vac. Sci. Technol. A.1984,2, 273.
V. J. Kapoor,Proceedings of the Third International Symposium on Ultra Large Scale Integration Science and Technology, ULSI Science and Technology, 1991, p. 657.
S. K. Lai,Proc. Electrochem. Soc. 1981,81–5 (Semicond. Silicon), 416.
T. Kaga, T. Hagiwara,IEEE Transactions on Electron Devices 1988,35, 929.
M. del Giudice, F. Bruno, T. Cicinelli, M. Valli,Appl. Opt. 1990,29, 3489.
M. Boudreau, M. Boumerzong, R. V. Kruzelecky, F. Mascher, P. E. Jessoop, D. A. Thompson,Mat. Res. Soc. Symp. Proc. 1993,300 (III–V Electronic and Photonic Device Fabrication and Performance), 183.
R. Müller-Fielder, K. -M. Mayer, Ch. Treutier, G. Benz,Bosch Technische Berichte,1994,56, 11.
D. Peters, K. Fischer, J. Müller,Sens. Actuators A.1991,A26, 425.
Y. Cros, N. Jaffrezic-Renault, J. M. Chovelon, J. J. Fombon,J. Electrochem. Soc. 1992,139, 507.
A. E. T. Kuiper, M. F. G. Willemsen, J. M. L. Mulder, J. B. Oude Elferink, F. H. P. M. Habraken, W. F. van der Weg,J. Vac. Sci. Technol. B. 1989,7, 455.
A. E. T. Kuiper, F. H. P. M. Habraken, A. van Oostrom, Y. Tamminga,Philips J. Res. 1983,38, 1.
S. P. Speakman, P. M. Read, A. Kiermasz,Ion Plasma Assisted Tech. 6th Int. Conf., 1987, p 273.
H. Reinhardt, D. Schalch, A. Scharmann,Thin Solid Films 1988,167, L1.
A. E. T. Kuiper, S. W. Koo, F. H. P. M. Habraken, Y. Tamminga,J. Vac. Sci. Technol. B.1983,1, 62.
L. Hrubcín, J. Huran, R. Sandrik, A. P. Kobzev, D. M. Shirokov,Nucl. Instrum. Methods Phys. Res. B. 1994,85, 60.
W. M. Arnoldbik, C. H. M. Marée, F. H. P. M. Habraken,Appl. Surf. Sci. 1994,74, 103.
J. C. Rostaing, Y. Cros, S. C. Gujrathi, S. Poulain,J. Non- Cryst. Solids 1987,97–98, 1051.
F. H. P. M. Harbraken, J. B. Oude Elferink, W. M. Arnold Bik, W. F. van der Weg, A. E. T. Kuiper, J. Remmerie, H. E. Maes, M. Heyns, R. F. de Keersmacker,LPCVD Silicon Nitride Oxynitride Films, chapter 1. (F. H. P. M. Habraken, ed.), Springer, Heidelberg, New York Tokyo, 1991, p. 1.
S. V. Nguyen, J. R. Abernathey, S. A. Fridmann, M. L. Gibson,ASTM Spec. Tech. Publ. 1987,960 (Emerging Semicond. Technol.), 173.
T. Carriere, B. Agius, I. Vickridge, J. Siejka, P. Alnot,J. Electrochem. Soc. 1990,137, 1582.
C. Rolfs, I. J. R. Baumvol,Z. Phys. A: Hadrons Nucl. 1995,353, 127.
V. J. Kapoor,Proceedings of the Third International Symposium on Ultra Large Scale Integration Science and Technology, ULSI Science and Technology, 1991, p. 657.
A. van Oostrom, L. Augustus, F. H. P. M. Habraken, A. E. T. Kuiper,J. Vac. Sci. Technol. 1982,20, 953.
H. H. Madden, P. H. Holloway,J. Vac. Sci. Technol. 1979,16, 618.
S. S. Chao, J. E. Tyler, D. V. Tsu, G. Lucovsky, J. Mantini,J. Vac. Sci. Technol. A. 1987,5, 1283.
D. V. Tsu, G. Lucovsky, M. J. Mantini, S. S. Chao,J. Vac. Sci. Technol. A. 1987,5, 1998.
R. Hezel,Radiat. Eff. 1982,65, 101.
W. Streb, R. Hezel,J. Vac. Sci. Technol. B. 1984,2, 626.
O. Benkherourou, J. P. Deville,Appl. Phys. A. 1988,A46, 87.
M. S. Hegde, R. Caracciolo, K. S. Hatton, J. B. Wachtman Jr.Appl. Surf. Sci. 1989,37, 16.
Y. Okamoto, H. Nagasawa, D. Kitayama, H. Kitajima, H. Ikoma,Jpn. J. Appl. Phys., part 2,1995,34, L955.
R. K. Brow, C. G. Pantano,J. Am. Ceramic Soc. 1986,69, 314.
R. I. Hedge, P. J. Tobin, K. G. Reid, B. Maiti, S. A. Ajuria,Appl. Phys. Lett. 1995,66, 2882.
I. W. Boyd,Materials Science Forum 1995,173–174, 81.
I. W. Boyd, J.-Y. Zhang, P. Bergonzo,Proc. SPIE 1995,2403, 290.
T. S. Eriksson, C. G. Granqvist,J. Appl. Phys. 1986,60, 2081.
G. Lucovsky, D. V. Tsu,J. Vac. Sci. Technol. A. 1987,5, 2231.
M. D. Diatezua, P. A. Thiry, Ph. Lambin, R. Caudano,Phys. Rev. B. 1993,48, 8701.
E. Fogarassy, C. Fuchs, A. Slaoui, S. de Unamuno, J. P. Stoquert,J. Appl. Phys. 1994,76, 2612.
S. K. Ghosh, T. K. Hatwar,Thin Solid Films 1988,166, 359.
S. K. Ray, S. Das, C. K. Maiti, S. K. Lahiri, N. B. Chakraborti,J. Appl. Phys. 1994,75, 8145.
P. V. Bulkin, P. L. Swart, M. Lacquet,J. Non-Cryst. Solids. 1995,187, 403.
J. W. Colby,Advances in X-ray Analysis. 1968,11, 287.
J. I. Goldstein, S. K. Choi, F. J. J. van Loo, H. J. M. Heijligers, G. F. Bastin, W. G. Sloof,Scanning,1993,15, 165.
G. F. Bastin, H. J. M. Heijligers,Microbeam Anal. 1992,1, 61.
J. M. Dijkstra, G. F. Bastin, H. J. M. Heijligers, D. Klepper,Mikrochim. Acta 1994,114/115, 277.
G. F. Bastin, H. J. M. Heijligers,Mikrochim. Acta [Suppl.] 1992,12, 19.
J. J. Goldstein, S. K. Choi, F. J. J. van Loo, H. J. M. Heijligers, J. M. Dijkstra, G. F. Bastin,Microbeam Anal. 1991,26, 57.
G. F. Bastin, H. J. M. Heijligers, X-Ray Spectrometry in Electron Beam Instruments, chapter 14. (D. Williams, J. Goldstein, D. Newbury, eds.), Plenum Press, New York, 1995, p. 239.
G. F. Bastin, H. J. M. Heijligers,Microbeam Anal. 1989,24, 207.
G. F. Bastin, H. I. M. Heijligers,Scanning,1991,13, 325.
Voyager reference manual, Noran Instruments Inc., Appendix C. 1993.
A. Monelli, F. Corni, R. Tonini, C. Ferrari, G. Ottaviani,J. Appl. Phys. 1996,80, 109.
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Dreer, S., Wilhartitz, P., Mersdorf, E. et al. Quantitative analysis of silicon-oxynitride films by EPMA. Mikrochim Acta 130, 281–288 (1999). https://doi.org/10.1007/BF01242917
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DOI: https://doi.org/10.1007/BF01242917