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Grain boundary sliding behaviour of copper and alpha brass at intermediate temperatures

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Abstract

The role of grain boundary sliding in copper and Cu-30% Zn in the temperature range 0.50 to 0.72T m, whereT m is the absolute melting point of the material, is examined. First, sliding data obtained on these materials are presented. These results indicate that the stress exponent for sliding,n gbs, is similar to that for lattice deformation, while the activation energy for sliding,Q gbs, varies between about 0·5Q c and 1.6Q c, whereQ c is the activation energy for creep. Next, a comparison of the published values ofQ gbs for bicrystals and polycrystals suggests that grain boundary sliding in polycrystalline materials requires the accommodation of the sliding process, whereas in bicrystals, the absence of triple points and other grain boundaries results in intrinsic sliding. Finally, several models proposed for grain boundary sliding are discussed, and it is shown that they do not account for the observed results on copper and alpha brass. A phenomenological model is proposed, where it is assumed that grain boundary sliding results from the glide of dislocations on secondary slip planes.

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  1. NASA Lewis Research Center, MS 49-1, 21000 Brookpark Road, 44135, Cleveland, Ohio, USA

    S. V. Raj

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Raj, S.V. Grain boundary sliding behaviour of copper and alpha brass at intermediate temperatures. J Mater Sci 26, 1000–1008 (1991). https://doi.org/10.1007/BF00576778

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