Abstract
The grain boundaries of a polycrystal play an important role in deformation processes, particularly under conditions of high-temperature creep. Firstly, the boundaries act as sources and sinks for vacancies, so that diffusional creep may occur by vacancy flow. Secondly, grain boundary sliding may occur under conditions where diffusional creep is relatively unimportant.
The various grain boundary deformation processes are reviewed, and the experimental procedures available for measurements of grain boundary sliding are described in detail. The few direct measurements reported for sliding in polycrystalline non-metals are summarized, and it is demonstrated that there is a considerable need for further work in this area. A new form of deformation mechanism map is presented which is simple to construct and which graphically illustrates the occurrence of grain boundary deformation processes.
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© 1975 Plenum Press, New York
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Langdon, T.G. (1975). Grain Boundary Deformation Processes. In: Bradt, R.C., Tressler, R.E. (eds) Deformation of Ceramic Materials. Springer, Boston, MA. https://doi.org/10.1007/978-1-4613-4431-5_4
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DOI: https://doi.org/10.1007/978-1-4613-4431-5_4
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