Abstract
The thermal stability of freely suspended silver films 100 nm thick is studied during isothermal annealing at temperatures of 350–600°C for different times. At temperatures of 350–450°C, only grain growth is observed. Above 450°C, along with grain growth, the formation and growth of hillocks and holes take place; in this case, grain boundaries are essential in the processes. A continuous film transforms into a cellular one. At 500°C, the growth processes of both grains and holes have the same incubation period, during which no grain growth, hole formation, and hole growth take place.
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Original Russian Text © V.G. Sursaeva, A.B. Straumal, 2016, published in Deformatsiya i Razrushenie Materialov, 2016, No. 7, pp. 15–18.
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Sursaeva, V.G., Straumal, A.B. Thermal stability of the microstructure of silver films. Russ. Metall. 2017, 263–266 (2017). https://doi.org/10.1134/S003602951704022X
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DOI: https://doi.org/10.1134/S003602951704022X