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Influences of original solder grain orientation on thermal fatigue damage and microstructure evolution of the SnAgCu/Cu solder joints revealed by in-situ characterization

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Abstract

To intuitively reveal the influences of original solder grain orientation on thermal fatigue damage mechanisms of the SnAgCu/Cu solder joints at relatively high temperature, in this study the solder joints were prepared, and their thermal fatigue damage and microstructure evolution processes were in-situ characterized. It was found that most of the solder joints are single crystal, and the others have 2 or 3 solder grains. Under the thermal cycling of 20 °C ~ 140 °C, the interfacial strain concentration is more serious than that cycled at relatively low temperature, and the damage accumulation rate is higher. The original solder grain orientation determines the activation of slip systems and the plastic deformation degree, especially at the interfacial strain concentration zone. Due to softening of the solder and the high recovery rate, deformation of the solder not close to the joint interface is not very serious. The slip bands are not straight, and the activated slip systems are the {110}<001 > and {100}<001 > systems, but different slip systems can be activated at different zones within one solder grain. For the solder joints with 2 or 3 solder grains, deformation of the grain with higher Schmidt factor is restricted by the other grains, and the deformation mismatch resulting in grain boundary (GB) sliding. The high temperature recovery and relative torsion between different parts of the solder grains form new low-angle GBs. For a group of solder joints, the joint most susceptible to deformation determines the life of the device.

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Funding

The authors wish to acknowledge the financial support of the National Natural Science Foundation of China (52001317), and the “Scientific and Technological Innovation 2025” Major Special Project of Ningbo City under Grant nos. 2021Z049 and 2020Z039.

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Authors and Affiliations

  1. Key Laboratory of Marine Materials and Related Technologies, Zhejiang Key Laboratory of Marine Materials and Protective Technologies, Ningbo Institute of Materials Technology and Engineering, Chinese Academy of Sciences, Ningbo, 315201, China

    Qingke Zhang, Chenwei An & Zhenlun Song

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  1. Qingke Zhang
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  2. Chenwei An
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Contributions

All authors contributed to the study conception and design. Material preparation, data collection and analysis were performed by [Qingke Zhang], [Chenwei An]. The first draft of the manuscript was written by [Qingke Zhang] and all authors commented on previous versions of the manuscript. All authors read and approved the final manuscript.

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Correspondence to Qingke Zhang.

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Zhang, Q., An, C. & Song, Z. Influences of original solder grain orientation on thermal fatigue damage and microstructure evolution of the SnAgCu/Cu solder joints revealed by in-situ characterization. J Mater Sci: Mater Electron 35, 306 (2024). https://doi.org/10.1007/s10854-024-12067-9

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