Abstract
Nanostructured Cu-/Al-laminated composites were processed by accumulative roll-bonding (ARB) technique for four cycles. Microstructural evolutions inside the Cu and Al layers and the interfacial reactions were revealed after annealing at different temperatures. Recovery and recrystallization occurred in the Cu and Al layers at low annealing temperatures, and three kinds of intermetallic compounds formed near the interfaces. The mechanical properties of these composites after annealing were investigated by tensile tests, and the variation of strength–ductility synergy was comprehensively discussed by considering the roles of constituent and the intermetallic compounds.
Similar content being viewed by others
References
Y.P. Li, G.P. Zhang, Acta Mater. 58, 3877 (2010)
S. Lyu, Y. Sun, L. Ren, W. Xiao, C. Ma, Adv. Eng. Mater. 19, 1700070 (2017)
Y. Zhang, X. Cheng, H. Cai, H. Zhang, J. Alloys Compd. 699, 695 (2017)
Y.F. Zhao, J.Y. Zhang, Y.Q. Wang, K. Wu, G. Liu, J. Sun, Nanoscale 11, 11340 (2019)
M. Huang, C. Xu, G. Fan, E. Maawad, W. Gan, L. Geng, F. Lin, G. Tang, H. Wu, Y. Du, D. Li, K. Miao, T. Zhang, X. Yang, Y. Xia, G. Cao, H. Kang, T. Wang, T. Xiao, H. Xie, Acta Mater. 153, 235 (2018)
H. Wu, G. Fan, M. Huang, L. Geng, X. Cui, H. Xie, Int. J. Plast. 89, 96 (2017)
N. Tsuji, Y. Ito, Y. Saito, Y. Minamino, Scr. Mater. 47, 893 (2002)
S.A. Hosseini, H.D. Manesh, Mater. Des. 30, 2911 (2009)
L. Su, C. Lu, H. Li, G. Deng, K. Tieu, Mater. Sci. Eng. A 614, 148 (2014)
X. Huang, N. Tsuji, N. Hansen, Y. Minamino, Mater. Sci. Eng. A 340, 265 (2003)
N. Takata, K. Yamada, K. Ikeda, F. Yoshida, H. Nakashima, N. Tsuji, Mater. Sci. Forum 503–504, 919 (2006)
X. Ma, C. Huang, J. Moering, M. Ruppert, H.W. Höppel, M. Göken, J. Narayan, Y. Zhu, Acta Mater. 116, 43 (2016)
S. Zheng, I.J. Beyerlein, J.S. Carpenter, K. Kang, J. Wang, W. Han, N.A. Mara, Nat. Commun. 4, 1696 (2013)
M. Eizadjou, A. Kazemi Talachi, H. Danesh Manesh, H. Shakur Shahabi, K. Janghorban, Compos. Sci. Technol. 68, 2003 (2008)
W.B. Lee, K.S. Bang, S.B. Jung, J. Alloys Compd. 390, 212 (2005)
C.J. Hang, C.Q. Wang, M. Mayer, Y.H. Tian, Y. Zhou, H.H. Wang, Microelectron. Reliab. 48, 416 (2008)
H.C. Kwon, T.K. Jung, S.C. Lim, M.S. Kim, Mater. Sci. Forum 449–452, 317 (2004)
K.Y. Rhee, W.Y. Han, H.J. Park, S.S. Kim, Mater. Sci. Eng. A 384, 70 (2004)
T.T. Sasaki, R.A. Morris, G.B. Thompson, Y. Syarif, D. Fox, Scr. Mater. 63, 488 (2010)
L. He, X. Zhiyong, W. Chunjing, L. Qing, W. Yuan, Acta Metall. Sin. -Engl. Lett. 23, 206 (2010)
I.K. Kim, S.I. Hong, Mater. Des. 47, 590 (2013)
Z. Mao, J. Xie, A. Wang, W. Wang, D. Ma, Metals 8, 645 (2018)
D. Chang, P. Wang, Y. Zhao, J. Alloys Compd. 815, 152453 (2020)
G. Heness, R. Wuhrer, W.Y. Yeung, Mater. Sci. Eng. A 483–484, 740 (2008)
E. Hug, N. Bellido, Mater. Sci. Eng. A 528, 7103 (2011)
M. H. M. Kouters, G. H. M. Gubbels, O. Dos Santos Ferreira, Microelectron. Reliab. 53, 1068 (2013)
M. Abbasi, A. Karimi Taheri, M. T. Salehi, J. Alloys Compd. 319, 233 (2001)
L.Y. Sheng, F. Yang, T.F. Xi, C. Lai, H.Q. Ye, Compos. Pt. B 42, 1468 (2011)
A. Gueydan, B. Domengès, E. Hug, Intermetallics 50, 34 (2014)
Q. Yu, X. Liu, Y. Sun, Sci. China Mater. 58, 574 (2015)
C.Y. Chen, W.S. Hwang, Mater. Trans. 48, 1938 (2007)
X.J. Liu, I. Ohnuma, R. Kainuma, K. Ishida, J. Alloys Compd. 264, 201 (1998)
X.H. An, S.D. Wu, Z.F. Zhang, R.B. Figueiredo, N. Gao, T.G. Langdon, Scr. Mater. 66, 227 (2012)
E. El-Danaf, S.R. Kalidindi, R.D. Doherty, Metall. Mater. Trans. A 30, 1223 (1999)
A.M. Russell, Adv. Eng. Mater. 5, 629 (2003)
Acknowledgements
This work was financially supported by the Fundamental Research Funds for the Central Universities under grant No. N180204015, the National Natural Science Foundation of China (NSFC) under Grant No. 51331007.
Author information
Authors and Affiliations
Corresponding authors
Additional information
Available online at http://link.springer.com/journal/40195.
Rights and permissions
About this article
Cite this article
Lin, H.R., Tian, Y.Z., Sun, S.J. et al. Microstructural Evolution and Mechanical Properties of Laminated CuAl Composites Processed by Accumulative Roll-Bonding and Annealing. Acta Metall. Sin. (Engl. Lett.) 34, 925–931 (2021). https://doi.org/10.1007/s40195-020-01179-w
Received:
Revised:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s40195-020-01179-w