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An Investigation of the Bonding Behavior of Aluminum Strips in the Presence of an Alumina Layer During the Cold Roll Bonding Process

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Abstract

In the present study, the effects of an alumina layer and its thickness on the bonding behavior of Al/Al strips were evaluated. To achieve this, aluminum strips were anodized at different times to generate alumina layers with various thicknesses. Furthermore, some samples were produced with alumina powder and the bond strength of these samples was compared with that of samples produced by the alumina layer. After the cold roll bonding process, peel test was carried out to evaluate the bond strength and weld efficiency of Al strips. The results of the peel test indicated that using a thin alumina layer (5 μm) led to a decrease in weld efficiency. However, by increasing the thickness of the alumina layer, weld efficiency also increased, reaching a higher level compared to Al strips without the anodized layer. Moreover, using alumina powder caused the deterioration of the bond strength compared with the samples fabricated by anodized alumina layer.

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Authors and Affiliations

  1. Department of Materials Engineering, Isfahan University of Technology, Isfahan, 84156-83111, Iran

    Hajar Farajzadeh Dehlordi, Mohammad Reza Toroghinejad & Keyvan Raeissi

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  1. Hajar Farajzadeh Dehlordi
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  2. Mohammad Reza Toroghinejad
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  3. Keyvan Raeissi
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Correspondence to Mohammad Reza Toroghinejad.

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Dehlordi, H.F., Toroghinejad, M.R. & Raeissi, K. An Investigation of the Bonding Behavior of Aluminum Strips in the Presence of an Alumina Layer During the Cold Roll Bonding Process. Trans Indian Inst Met 72, 685–691 (2019). https://doi.org/10.1007/s12666-018-1520-8

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  • DOI: https://doi.org/10.1007/s12666-018-1520-8

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