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High-current pulsed electron beam modification on microstructure and performance of Cu/CuW diffusion bonding joints

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Abstract

This study investigates the influence of high-current pulsed electron beam (HCPEB) modification on the microstructure and shear strength of Cu/CuW joints. Reliable solid-state diffusion bonding of modified-Cu (M-Cu) and modified-CuW (M-CuW) was achieved by HCPEB modification pretreatment at a temperature of 800–900 °C and a pressure of 5 MPa for 10–50 min. Experiments demonstrate that HCPEB modification facilitates the dissolution of W and Cu, resulting in the formation of a Cu0.4W0.6 solid solution and thus enhancing the uniform distribution of microstructures. Additionally, HCPEB-induced defects play a beneficial role in promoting the diffusion process by providing fast diffusion paths for elements. The optimal joints with the maximum shear strength of 213.7 MPa were obtained through bonding M-Cu and M-CuW at 900 °C and 5 MPa for 30 min, which attributes to the combined effects of fine-grained strengthening and solid solution strengthening. Overall, the application of HCPEB modification showcases its effectiveness in promoting element diffusion and enhancing the mechanical performance of the joints.

Graphical abstract

摘要

我们研究了强流脉冲电子束（HCPEB）改性对Cu/CuW接头微结构和剪切强度的影响。对HCPEB改性预处理后的样品，在800–900 ℃的温度条件下施加5 MPa的压力，进行10–50 min的保温，实现了M-Cu和M-CuW的固态扩散焊接。实验结果表明，HCPEB改性有助于W和Cu的固溶，形成均匀分布的Cu0.4W0.6。此外，HCPEB诱导的丰富晶体缺陷促进了焊接过程的进行，为元素提供快速扩散路径。通过在900 ℃温度下施加5 MPa的压力保温30 min的条件下连接M-Cu和M-CuW，得到了剪切强度为213.7 MPa的最佳接头。接头性能的提升归因于细晶强化和固溶体强化。综上所述，HCPEB表面改性促进了元素扩散和并有效提高了接头力学性能。

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Acknowledgements

This work was financially supported by the National Natural Science Foundation of China (No. 52001273) and the Natural Science Foundation of Jiangsu Province (No. BK20201062).

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Authors and Affiliations

  1. School of Materials Science and Engineering, Jiangsu University, Zhenjiang, 212013, China

    Na-Na Tian, Cong-Lin Zhang, Peng Lyu, Jin-Tong Guan, Qing-Feng Guan & Shun Guo

  2. School of Material Science and Engineering, Yancheng Institute of Technology, Yancheng, 221051, China

    Cong-Lin Zhang

  3. Engineering Institute of Advanced Manufacturing and Modern Equipment Technology, Jiangsu University, Zhenjiang, 212013, China

    Jie Cai

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Tian, NN., Zhang, CL., Lyu, P. et al. High-current pulsed electron beam modification on microstructure and performance of Cu/CuW diffusion bonding joints. Rare Met. 43, 2819–2831 (2024). https://doi.org/10.1007/s12598-024-02617-9

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