Abstract
The three-layered (W–60 vol%Cu/W–40 vol%Cu/W–20 vol%Cu) W/Cu functionally graded material (FGM) containing a Cu network structure was fabricated at different temperatures by hot-pressed sintering produced from copper-coated tungsten powders. The effects of various sintering temperatures on relative density, microstructure, thermal conductivity, hardness and flexural strength were investigated. Scanning electron microscopy (SEM) and X-ray diffraction (XRD) analysis show that a Cu network extends throughout the W/Cu FGM specimens sintered at 1065 °C and the graded structure can be retained perfectly, and W particles are distributed homogeneously. The low-temperature sintering densification of W/Cu FGM arises because the sintering mode of the copper-coated tungsten particles includes just sintering Cu to Cu, rather than Cu to W, Cu to Cu and W to W, as required for conventional powder particles. The relative density of W/Cu FGM sintered at 1065 °C for 3 h under a load of 25 MPa is 96.1%. The thermal conductivity is up to 204 W·m−1·K−1 at normal temperature and 150 W·m−1·K−1 at 800 °C. And the Vickers hardness varies with the gradient of different layers from 3.34 to 4.05 GPa.
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This work was financially supported by the Wenzhou Public Welfare Technology Research Industry Project (No. G20140042).
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Tian, P., Feng, Y., Xia, M. et al. Hot-pressed sintering of W/Cu functionally graded materials prepared from copper-coated tungsten powders. Rare Met. 39, 1229–1236 (2020). https://doi.org/10.1007/s12598-017-0939-0
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DOI: https://doi.org/10.1007/s12598-017-0939-0