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Evaluation on Ground Surface Accuracies of Large-Depth and Steeply Micro-Structured SiC Surfaces

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Abstract

Microstructures can be used to enhance technical surfaces with additional functionalities, which are driving advances in many fields of industrial applications. However, it is difficult to obtain 3D valid information about large-depth and steeply micro-structured surfaces owing to the limitation of the white light interferometric measurements. Therefore, the registration of bisection-measured micro-topographies is proposed using the interactive closest point (ICP) method combined with the genetic algorithm, with the objective of evaluating the micro-form and micro-profile accuracies of a micro-structured surface. First, a diamond grinding-wheel V-tip was employed to fabricate micro-pyramid-structured SiC; subsequently, 3 ideal point models were constructed to match the measured point clouds using the ICP method; finally, the non-dominated sorting genetic algorithm-II (NSGA-II) was used to micro-alignment the bisection-measured point clouds with regard to micro-form and micro-profile errors. It is shown that the registration accuracy is dominated by the ideal profile point number, but the registration efficiency depends on the ideal point number. The the NSGA-II could improve the registration accuracy of micro-profile by 42.6% compared with traditional ICP matching. It is confirmed that the micro-grinding is able to control the micro-form and the micro-profile accuracies within 4%.

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Acknowledgements

This project is supported by the Science and Technology Program of Guangzhou, China (Grant No. 907256560048), the Innovative Team Project of Guangdong Universities (2017KCXTD025) and the Innovative Academic Team Project of Guangzhou Education System (1201610013).

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  1. School of Mechanical and Electric Engineering, Guangzhou University, Guangzhou, 510006, China

    Ping Li, Xiaochu Liu & Junwu Chen

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  1. Ping Li
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  2. Xiaochu Liu
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Correspondence to Ping Li.

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Li, P., Liu, X. & Chen, J. Evaluation on Ground Surface Accuracies of Large-Depth and Steeply Micro-Structured SiC Surfaces. Int. J. Precis. Eng. Manuf. 22, 259–270 (2021). https://doi.org/10.1007/s12541-020-00442-5

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