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Surface enhancement for boiling heat transfer through micro holes for electronic cooling applications

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Abstract

This work reports the nucleate boiling heat transfer characteristics of n-pentane on smooth and enhanced surfaces. Surface modifications were carried out on stainless steel surfaces by fabricating microholes of diameter between 0.3 and 0.7 mm arrays using electric discharge machining. Pool boiling experiments were carried out at normal atmospheric pressure. Experiments have been performed for applied effective heat flux range between 1 and 10 W cm−2. An enhancement of 20–45% in heat transfer coefficient was observed on the enhanced surface compared to the smooth surface. The heat transfer improvement in the enhanced surface can be attributed to more active nucleation sites, better rewetting phenomenon, and favorable bubble growth and release mechanism. Further changing the material from steel to brass enhances the heat transfer coefficient by 20%. This will be a viable option as a cooling technology for high-power electronic industries.

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Abbreviations

q″ :

Heat flux (W/m2)

T :

Temperature (K)

k :

Thermal conductivity (W/mK).

h :

Heat transfer coefficient (W/m2K)

I :

Applied current (A)

V :

Voltage (V)

T w :

Wall temperature (K)

T s :

Saturation temperature (K)

ΔX :

Distance between thermocouples (m)

δ :

Uncertainty

eff :

Effective

in :

Input

CHF:

Critical heat flux

HTC:

Heat transfer coefficient

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Acknowledgements

This work was supported by Department of Science and Technology (DST-SERC), India (Grant SR/FTP/ETA-0017/2010).

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Institute of Technology Jamshedpur, Jamshedpur, Jharkhand, 831014, India

    Rinku Kumar Gouda

  2. Department of Design, School of Engineering, Tezpur University, Tezpur, Assam, 784028, India

    G Srinivasan

  3. Tharam-Thiran Green Energy Flow LLP, MaDeIT Innovation Foundation, Indian Institute of Information Technology Design and Manufacturing Kancheepuram, IIITDM Kancheepuram, Chennai, 600127, India

    V Umesh

  4. Department of Mechanical Engineering, Indian Institute of Information Technology Design and Manufacturing Kancheepuram, IIITDM Kancheepuram, Chennai, 600127, India

    B Raja

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  1. Rinku Kumar Gouda
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  2. G Srinivasan
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  3. V Umesh
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  4. B Raja
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Correspondence to G Srinivasan or B Raja.

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On behalf of all authors, I disclose that there is no any actual or potential conflict of interest including any financial, personal or other relationships with other people or organizations during the execution of the works reported in the draft entitled “Surface enhancement for boiling heat transfer through micro holes for electronic cooling applications”

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Gouda, R.K., Srinivasan, G., Umesh, V. et al. Surface enhancement for boiling heat transfer through micro holes for electronic cooling applications. Sādhanā 48, 210 (2023). https://doi.org/10.1007/s12046-023-02251-8

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  • DOI: https://doi.org/10.1007/s12046-023-02251-8

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