Abstract
Boiling is a phase change heat transfer process that transfers latent heat quickly, making it suitable for use in various heat transfer systems. An important worry for the boiling performance degradation is the durability of the artificial nano-/microporous interfaces concerning the bottom surface. This study therefore proposes a novel three-step surface creation process (chemical etching, electroplating, and sintering process). Wet/chemical etching is first used to form three distinct micro/nanostructured substrates (ES#1, 2, 3). The most effective etched substrate (ES#3) is again employed as a cathode for the electrochemical depositing process or next-of-surface manufacturing. To strengthen the link between the etched layer (ES#3) and the surface of the coating (copper-alumina), the electroplating produced substrate (ES#4) is sintered in a predetermined environment. The enhanced boiling efficiency obtained on ES#4 is attributable to the appropriate bonding among ES#3 and electroplated nanoparticles (Cu-Al2O3). By maintaining a consistent temperature across the heater's topmost layer and the fin tip, the reduction in resistance at the intermediate level brought on by appropriate binding increases the rate of heat transfer. The critical heat flux (CHF) and heat transfer coefficient (HTC) improvements for ES#4 over bare copper are 184% and 216%, respectively. Additionally, the impact of certain macro- and micro-scale restrictions on the occurrence of flow boiling heat transfer is examined. The ES#4 surface showed better stability during repeated thirty testing cycles, as seen by the much smaller decline in superheat temperatures (1.2 °C) and wettability (32° to 33.7°).
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The SAIF at IIT Mumbai, India, and NIT, Silchar, India, who provided the FEG-SEM and boiling experimental facilities, respectively, are warmly acknowledged by the authors.
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Gupta, S.K. Experimental Study on the Flow Boiling (Two-Phase) Heat Transfer of High-Density Micro-/Nano-Porous Copper-Alumina-Copper Nano-composite-Coated Surfaces. Arab J Sci Eng 49, 8237–8259 (2024). https://doi.org/10.1007/s13369-024-08846-5
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DOI: https://doi.org/10.1007/s13369-024-08846-5