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Flow Boiling Performance Analysis of Copper–Titanium Oxide Micro-/Nanostructured Surfaces Developed by Single-Step Forced Convection Electrodeposition Technique

  • Research Article-Mechanical Engineering
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Abstract

As per the available literature, most of the techniques used for boiling surface modification utilize high operational temperature and longer production duration, ensuing in higher energy utilization with more safety worries for large scale of manufacturing. Again, the important criterion for boiling surfaces is to control the porous layer (porosity) to achieve high rate of cooling. Considering these aspects, a nature-inspired and simple technique for surface modification is proposed in the present work, which is single-step forced convection electrochemical deposition followed by single-step sintering. In this technique, the surface properties can be easily managed. Using this technique, the nanocomposite coatings of higher thermal conductive Cu–TiO2 (~ 300 W/mK) nanoparticles are fabricated on copper heating surface. The growth in nanograins is occurred during sintering process, which enhances the connectivity between the deposited nanograins. The porosity, thickness of porous layer, roughness, and wettability of the electrodeposited structured surfaces are raised with amplified current supply up to 75%, 42 µm, 1.32 µm, and 38°, respectively. The heat transfer performances of these developed surfaces are analyzed through flow boiling experiments. The maximum enhancement in critical heat flux (~ 143%) and heat transfer coefficient (~ 153%) is attained on developed coated surface at lower mass flux. These augmentations are attributed to better surface wettability and better surface morphological characteristics of the developed surfaces, which are due to the existence of sufficient liquid microlayer on them. The proposed electrodeposition technique can be employed for practical cooling applications where effective handling of high rate of heat flux is a challenge.

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Abbreviations

A s :

Cross-sectional area of heating surface, m2

h :

Heat transfer coefficient, W/m2K

I :

Current, A

k :

Thermal conductivity, W/mK

Q :

Supplied heat to the copper block, W

q :

Heat flux, W/cm2

T o :

Outlet working fluid temperature, K

T i :

Inlet fluid temperature, K

T w :

Wall surface temperature of copper block, K

T m :

Mean wall surface temperature of copper block, K

ΔT :

Wall superheat temperature, K

V :

Voltage, V

x :

Distance between two thermocouples positions, m

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Authors and Affiliations

  1. Department of Mechanical Engineering, National Institute of Technology, Silchar, Assam, 788010, India

    Sanjay Kumar Gupta & Rahul Dev Misra

  2. Department of Mechanical Engineering, GMR Institute of Technology, Rajam, Andhra Pradesh, 532127, India

    Sanjay Kumar Gupta

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Correspondence to Sanjay Kumar Gupta.

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Gupta, S.K., Misra, R.D. Flow Boiling Performance Analysis of Copper–Titanium Oxide Micro-/Nanostructured Surfaces Developed by Single-Step Forced Convection Electrodeposition Technique. Arab J Sci Eng 46, 12029–12044 (2021). https://doi.org/10.1007/s13369-021-05850-x

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