Skip to main content
Log in

Fabrication of Metallic Glass Powder for Brazing Paste for High-Temperature Thermoelectric Modules

  • Topical Collection: International Conference on Thermoelectrics 2017
  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

Metallic glass (MG) offers the advantage of outstanding oxidation resistance, since it has disordered atomic-scale structure without grain boundaries. We fabricated Al-based MG ribbons (Al84.5Y10Ni5.5) by a melt spinning process. We evaluated the adhesion strength of interfaces between the Al-based MG and a Ni-coated Cu electrode formed under various conditions at high temperature. In addition, we attempted to optimize the process conditions for pulverizing MG ribbons to < 100 micrometers by combining high-energy ball milling and planetary milling. We confirmed that the electrical resistivity of the Al-based MG ribbon was substantially reduced after annealing at high temperature (over 300°C) due to crystallization.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Similar content being viewed by others

References

  1. D.M. Rowe, General principles and basic considerations, in Thermoelectric Handbook: Macro to Nano, (CRC Press, Boca Raton, 2006)

  2. K. Park, S. You, S. Ur, I. Kim, S. Choi, and W. Seo, J. Electron. Mater. 41, 1051 (2012).

    Article  Google Scholar 

  3. K. Park, W. Seo, S. Choi, and I. Kim, J. Korean Phys. Soc. 79, 64 (2014).

    Google Scholar 

  4. S. Choi, K. Kim, S. Jeong, H. Choi, Y. Lim, W. Seo, and I. Kim, J. Electron. Mater. 1004, 41 (2012).

    Google Scholar 

  5. K. Bae, S. Choi, K. Kim, H. Choi, W. Seo, I. Kim, S. Lee, and H. Hwang, J. Electron. Mater. 2124, 44 (2015).

    Google Scholar 

  6. Y. Lee, S. Kim, B. Kim, S. Lee, W. Seo, I. Kim, and S. Choi, J. Electron. Mater. 46, 3083 (2017).

    Article  Google Scholar 

  7. C. Lim, S. Choi, W. Seo, and H. Park, J. Electron. Mater. 1247, 41 (2012).

    Google Scholar 

  8. S. Choi, K. Lee, C. Lim, and W. Seo, J. Energy Convers. Manag. 52, 335 (2011).

    Article  Google Scholar 

  9. B. Song, S. Lee, S. Cho, M. Song, S. Choi, W. Seo, Y. Yoon, and W. Lee, J. Alloys Compd. 160, 617 (2014).

    Google Scholar 

  10. C. Lim, S. Choi, W. Seo, M. Lee, K. Lee, and H. Park, Electron. Mater. Lett. 445, 9 (2013).

    Google Scholar 

  11. Y. Saotome and H. Iwazaki, Microsyst. Technol. 6, 126 (2000).

    Article  Google Scholar 

  12. ASTM D6862: Standard test method for 90 degree Peel Adhesion, Annual Book of ASTM Standards, (ASTM International, West Conshohocken, 1997)

  13. ASM Alloy Phase Diagram Database, 2004, http://mio.asminternational.org/apd/index.aspx

Download references

Author information

Authors and Affiliations

Authors

Corresponding authors

Correspondence to Suk Jun Kim or Soon-Mok Choi.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Seo, SH., Kim, S.J., Lee, S. et al. Fabrication of Metallic Glass Powder for Brazing Paste for High-Temperature Thermoelectric Modules. J. Electron. Mater. 47, 3159–3163 (2018). https://doi.org/10.1007/s11664-017-5933-7

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-017-5933-7

Keywords

Navigation