Abstract
Metallic glass (MG) offers the advantage of outstanding oxidation resistance, since it has disordered atomic-scale structure without grain boundaries. We fabricated Al-based MG ribbons (Al84.5Y10Ni5.5) by a melt spinning process. We evaluated the adhesion strength of interfaces between the Al-based MG and a Ni-coated Cu electrode formed under various conditions at high temperature. In addition, we attempted to optimize the process conditions for pulverizing MG ribbons to < 100 micrometers by combining high-energy ball milling and planetary milling. We confirmed that the electrical resistivity of the Al-based MG ribbon was substantially reduced after annealing at high temperature (over 300°C) due to crystallization.
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Seo, SH., Kim, S.J., Lee, S. et al. Fabrication of Metallic Glass Powder for Brazing Paste for High-Temperature Thermoelectric Modules. J. Electron. Mater. 47, 3159–3163 (2018). https://doi.org/10.1007/s11664-017-5933-7
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DOI: https://doi.org/10.1007/s11664-017-5933-7