Research for Brazing Materials of High-Temperature Thermoelectric Modules with CoSb₃ Thermoelectric Materials

Abstract

Metallic glass (MG) can be a candidate for an alternative brazing material of high-temperature thermoelectric modules, since we can expect both a lower brazing temperature and a high operating temperature for the junction from the MG brazers. Another advantage of MG powders is their outstanding oxidation resistance, namely, high-temperature durability in atmosphere. We fabricated three compositions of Al-based MGs—Al-Y-Ni, Al-Y-Ni-Co, and Al-Y-Ni-Co-La—by using the melt spinning process, and their T _gs were 273°C, 264°C, and 249°C, respectively. The electrical resistivity of the Al-Y-Ni MG ribbon dropped significantly after annealing at 300°C. The electrical resistivity of crystallized Al-Y-Ni reduced down to 0.03 mΩ cm, which is an order of magnitude lower than that of the amorphous one. After the MG ribbons were pulverized to sub-100 μm, the average particle size was about 400 μm.