Skip to main content
SpringerLink
Log in

Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC–Cu Solder Joints During Different Types of Thermomechanical Excursion

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

The effects of mechanical strain on the growth kinetics of interfacial intermetallic compounds (IMCs) sandwiched between Cu substrate and Sn-1.0 wt.%Ag-0.5 wt.%Cu (SAC105) solder have been investigated. Isothermal aging (IA) at 70°C and 125°C, and thermal cycling (TC) as well as thermomechanical cycling (TMC) with shear strain of 12.8% per cycle between −25°C and 125°C were applied to diffusion-bonded solder joints to study the growth behavior of the interfacial IMC layer under various types of thermomechanical excursion (TME). The microstructure of the solder joint tested under each TME was observed at regular intervals. It was observed that the growth rate of the IMC layer was higher in the case of TMC compared with TC or IA. This increased growth rate of the IMC layer in the presence of mechanical strain suggests an additional driving force that enhances the growth kinetics of the IMC. Finite element analysis was performed to gain insight into the effect of TC and TMC on the stress field in the solder joint, especially near the interface between the solder and the substrate. Finally, an analytical model was developed to quantify the effect of strain on the effective diffusivity and express the growth kinetics for all three types of TME using a single expression.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. P. Vianco, J. Regent, and P. Hlava, J. Electron. Mater. 33, 991 (2004).

    Article  Google Scholar 

  2. L. Xu, and J.H.L. Pang, in Electronic Components and Technology Conference (2006), pp. 275–282.

  3. A. Paul, C. Ghosh, and W.J. Boettinger, Metall. Mater. Trans. A 42A, 952 (2011).

    Article  Google Scholar 

  4. K. Subramanian, Lead-Free Solders: Materials Reliability for Electronics, 1st ed. (Hoboken, NJ: Wiley, 2012).

    Book  Google Scholar 

  5. K.N. Tu, Acta Metall. 21, 347 (1973).

    Article  Google Scholar 

  6. I. Dutta, P. Kumar, and G. Subbarayan, JOM 61, 29 (2009).

    Article  Google Scholar 

  7. P. Kumar, Z. Huang, S.C. Chavali, D.K. Chan, I. Dutta, G. Subbarayan, and V. Gupta, IEEE Trans. Compon. Packag. Technol. 2, 256 (2012).

    Article  Google Scholar 

  8. A.A. El-Daly, A.E. Hammad, A. Fawzy, and D.A. Nasrallh, Mater. Des. 43, 40 (2013).

    Article  Google Scholar 

  9. D.A. Shnawah, S.B.M. Said, M.F.M. Sabri, I.A. Badruddin, and F.X. Che, Mater. Sci. Eng. A 551, 160 (2012).

    Article  Google Scholar 

  10. A.A. El-Daly, W.M. Desoky, T.A. Elmosalami, M.G. El-Shaarawy, and A.M. Abdraboh, Mater. Des. 65, 1196 (2015).

    Article  Google Scholar 

  11. P. Kumar, B. Talebanpour, U. Sahaym, C.H. Wen, and I. Dutta, in 13th IEEE Itherm Conference Proceedings (2012), pp. 880–887.

  12. R. Ghosh, A. Kanjilal, and P. Kumar, Microelectron. Reliab. 74, 44 (2017).

    Article  Google Scholar 

  13. Z. Mei, Lead Free Solder Interconnect Reliability, ed. D. Shangguan (New York: ASM International, 2005), p. 29.

    Google Scholar 

  14. K. Zeng and K.N. Tu, Mater. Sci. Eng. R Rep 38, 55 (2002).

    Article  Google Scholar 

  15. https://en.wikipedia.org/wiki/Thermal_expansion. Accessed 6 July 2017.

  16. T.T. Nguyen, D. Yu, and S.B. Park, J. Electron. Mater. 40, 1409 (2011).

    Article  Google Scholar 

  17. http://www.metallurgy.nist.gov/mechanical_properties/room temp_properties.jpg-CTEofIMC. Accessed 6 July 2017.

  18. http://www.topline.tv/CCGA_Material.html. Accessed 6 July 2017.

  19. G. Lim, B. Kim, K. Lee, J. Kim, Y. Joo, and Y. Park, J. Electron. Mater. 38, 2228 (2009).

    Article  Google Scholar 

  20. M. Jeong, J. Kim, B. Kwak, and Y. Park, Microelectron. Eng. 89, 50 (2012).

    Article  Google Scholar 

  21. B. Talebanpor, Z. Huang, Z. Chen, and I. Dutta, J. Electron. Mater. 45, 57 (2016).

    Article  Google Scholar 

  22. A. Paul and S. Divinski, Handbook of Solid State Diffusion: Volume 2: Diffusion Analysis in Material Applications (Elsevier, 2017)

  23. W.J. Boettinger, C.E. Johnson, L.A. Bendersky, K.W. Moon, M.E. Williams, and G.R. Stafford, Acta Mater. 53, 5033 (2005).

    Article  Google Scholar 

  24. I. Dutta, J. Electron. Mater. 32, 201 (2003).

    Article  Google Scholar 

  25. M.A. Clarkt and T.H. Alden, Acta Metall. 21, 1195 (1973).

    Article  Google Scholar 

  26. L. Xu, and J.H.L. Pang, in Electronics Packaging Technology Conference (2005), pp. 863–867.

  27. L. Zhang, S.B. Xue, G. Zeng, L.L. Gao, and H. Ye, J. Alloys Compd. 510, 38 (2012).

    Article  Google Scholar 

  28. J. Shen, M. Zhao, P. He, and Y. Pu, J. Alloys Compd. 574, 451 (2013).

    Article  Google Scholar 

  29. J.H.L. Pang, L. Xu, X.Q. Shi, W. Zhou, and S.L. Ngoh, J. Electron. Mater. 33, 1219 (2004).

    Article  Google Scholar 

  30. P.T. Vianco, J.J. Stephens, and J.A. Rejent, IEEE Trans. Compon. Packag. Technol. 20, 478 (1997).

    Article  Google Scholar 

  31. L. Xu, J.H.L. Pang, K.H. Prakash, and T.H. Low, IEEE Trans. Compon. Packag. Technol. 28, 408 (2005).

    Article  Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Department of Materials Engineering, Indian Institute of Science, Bangalore, 560012, India

    Anwesha Kanjilal & Praveen Kumar

Authors
  1. Anwesha Kanjilal
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Praveen Kumar
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Praveen Kumar.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Kanjilal, A., Kumar, P. Growth of Interfacial Intermetallic Compound Layer in Diffusion-Bonded SAC–Cu Solder Joints During Different Types of Thermomechanical Excursion. J. Electron. Mater. 47, 457–469 (2018). https://doi.org/10.1007/s11664-017-5786-0

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-017-5786-0

Keywords

Search

Navigation