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Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System

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Abstract

The tracer diffusion coefficients of the elements as well as the integrated interdiffusion coefficients are determined for the Cu3Sn and Cu6Sn5 intermetallic compounds using incremental diffusion couples and Kirkendall marker shift measurements. The activation energies are determined for the former between 498 K and 623 K (225 °C and 350 °C) and for the latter between 423 K and 473 K (150 °C and 200 °C). Sn is found to be a slightly faster diffuser in Cu6Sn5, and Cu is found to be the faster diffuser in Cu3Sn. The results from the incremental couples are used to predict the behavior of a Cu/Sn couple where simultaneous growth of both intermetallics occurs. The waviness at the Cu3Sn/Cu6Sn5 interface and possible reasons for not finding Kirkendall markers in both intermetallics in the Cu/Sn couple are discussed.

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Acknowledgments

One of the authors (AP) acknowledges the financial support received from the Department of Science and Technology, Government of India (Grant No. SR/FTP/ETA-18/2006), for this research work. WJB expresses gratitude to Ursula Kattner, NIST, for computing the thermodynamic parameters for the intermetallic phases and to the NIST Office of Microelectronic Programs for support.

Note added in proof

The recent research[39] conducted at Purdue University reports qualitatively similar results to this article.

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Authors and Affiliations

  1. Department of Materials Engineering, Indian Institute of Science, Bangalore, India

    A. Paul (Associate Professor) & C. Ghosh (PhD Student)

  2. Metallurgy Division, NIST, Gaithersburg, MD, 20899, USA

    W. J. Boettinger (NIST Fellow)

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  1. A. Paul
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  2. C. Ghosh
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  3. W. J. Boettinger
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Correspondence to W. J. Boettinger.

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Manuscript submitted April 22, 2010.

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Paul, A., Ghosh, C. & Boettinger, W.J. Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System. Metall Mater Trans A 42, 952–963 (2011). https://doi.org/10.1007/s11661-010-0592-9

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