Skip to main content
SpringerLink
Log in

Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

  • Published:
Journal of Electronic Materials Aims and scope Submit manuscript

Abstract

The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. T. Mattila, J. Hokka, and M. Paulasto-Krockel, J. Electron. Mater. 43, 4090 (2014).

    Article  Google Scholar 

  2. D.R. Frear and P.T. Vianco, Metall. Trans. A 25A, 1509 (1994).

    Article  Google Scholar 

  3. J. Glazer, Int. Mater. Rev. 40, 65 (1995).

    Article  Google Scholar 

  4. K. Yazzie, H. Fei, J. Williams, H. Jiang, and N. Chawla, J. Electron. Mater. 38, 2746 (2009).

    Article  Google Scholar 

  5. H.G. Song, J.W. Morris Jr., and F. Hua, JOM 56, 30 (2002).

    Article  Google Scholar 

  6. H.K. Kim and K.N. Tu, Phys. Rev. B 53, 16027 (1996).

    Article  Google Scholar 

  7. T.-K. Lee, C. Kim, and T. Bieler, J. Electron. Mater. 43, 69 (2014).

    Article  Google Scholar 

  8. T.-K. Lee, B. Zhou, T. Bieler, C. Tseng, and J. Duh, J. Electron. Mater. 42, 215 (2013).

    Article  Google Scholar 

  9. T.-K. Lee, W. Xie, and C. Guirguis, in Proceeding of IEEE 65th Electronic Components and Technology Conference (2015), pp. 1560–1565.

  10. V. Fiori, K. Ewuame, S. Lallois-Garreignot, H. Jaouen, and C. Tavernier, Microelectron. Reliab. 54, 764 (2014).

    Article  Google Scholar 

  11. J. Karppinen, T. Laurila, T. Mattila, and M. Paulasto-Krockel, J. Electron. Mater. 41, 3232 (2012).

    Article  Google Scholar 

  12. B. Noh, J. Yoon, S. Ha, and S. Jung, J. Electron. Mater. 40, 224 (2011).

    Article  Google Scholar 

  13. W. Peng and M.E. Marques, J. Electron. Mater. 36, 1679 (2007).

    Article  Google Scholar 

  14. JEDEC JC-14 Committee, Board Level Drop Test Method of Components for Handheld Electronic Products (JEDEC Standard JESD22-B111, 2003). www.jedec.org/standards- documents/docs/jesd-22-b111.

  15. J. Savic, M. Nagar, W. Xie, M. Ahmad, D. Senk, A. Bansal, N. Islam, P. Oh, R. Pendse, H. Choi, and S. Lee, in Proceeding of IEEE 62nd Electronic Components and Technology Conference (2012), pp. 450–456.

Download references

Author information

Authors and Affiliations

  1. Mechanical and Materials Engineering, Portland State University, Portland, OR, USA

    Tae-Kyu Lee & Zhiqiang Chen

  2. Center for Electron Microscopy and Nanofabrication, Portland State University, Portland, OR, USA

    Zhiqiang Chen & Greg Baty

  3. Michigan State University, East Lansing, MI, USA

    Thomas R. Bieler

  4. University of Texas, Arlington, TX, USA

    Choong-Un Kim

Authors
  1. Tae-Kyu Lee
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Zhiqiang Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Greg Baty
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Thomas R. Bieler
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Choong-Un Kim
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding author

Correspondence to Tae-Kyu Lee.

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Lee, TK., Chen, Z., Baty, G. et al. Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance. J. Electron. Mater. 45, 6177–6183 (2016). https://doi.org/10.1007/s11664-016-4902-x

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s11664-016-4902-x

Keywords

Search

Navigation