ABSTRACT
The mechanical stability and thermo-mechanical fatigue performance of solder joints with low silver content Sn-1.0Ag-0.5Cu (wt.%) (SAC105) alloy based on different cooling rates are investigated in high G level shock environment and thermal cycling conditions. The cooling rate-controlled samples ranging from 1°C/min to 75°C/min cooling rate, not only show differences in microstructure, where a fine poly-granular microstructure develops in the case of fast cooling versus normal cooling, but also show various shock performances based on the microstructure changes. The fast cooling rate improves the high G shock performance by over 90% compared to the normal cooled SAC105 alloy air-cooling environment commonly used after assembly reflow. The microstructure effect on thermal cycling performance is also discussed, which is analyzed based on the Sn grain orientation, interconnect stability, and solder joint bulk microstructure.
Similar content being viewed by others
References
H.G. Song, J.W. Morris Jr., and F. Hua, JOM 56, 30 (2002).
D.R. Frear and P.T. Vianco, Metall. Trans. A 25A, 1509 (1994).
H.K. Kim and K.N. Tu, Phys. Rev. B 53, 16027 (1996).
P. Lall, R. Lowe, and K. Goebel, in IEEE 60th Electronic Components and Technology Conference (ECTC), Las Vegas, NV, June 2010, p. 889.
T.-K. Lee, T.R. Bieler, C.-U. Kim, and H. Ma, Fundamentals of lead-free soldering technology, chap. 1 (New York: Springer, 2014).
C.-U. Kim, W.-H. Bang, H. Xu, and T.-K. Lee, J. Metals 65, 1362 (2013).
H. Xu, W.-H. Bang, T.-K. Lee, and C.-U. Kim, in IEEE 62nd Electronic Components and Technology Conference (ECTC), San Diego, June 2012, p. 500.
W. Pengand and M.E. Marques, J. Electron. Mater. 36, 1679 (2007).
B. Noh, J. Yoon, S. Ha, and S. Jung, J. Electron. Mater. 40, 224 (2011).
T.-K. Lee, B. Zhou, T. Bieler, C.F. Tseng, and J.G. Duh, J. Electron. Mater. 42, 215 (2013).
JEDEC Standard JESD22-B111, July 2003.
T.-K. Lee, B. Zhou, T. Bieler, and K.-C. Liu, J. Electron. Mater. 41, 273 (2012).
B. Zhou, T. Bieler, T.-K. Lee, and K.-C. Liu, J. Electron. Mater. 39, 2669 (2010).
P. Darbandi, F. Pourboghrat, T. Bieler, and T.-K. Lee, J. Electron. Mater. 43, 2521 (2014).
ASTM E112 12, vol. 3(1), (2013).
T.-K. Lee, C.-U. Kim, and T. Bieler, J. Electron. Mater. 43, 69 (2014).
Author information
Authors and Affiliations
Corresponding author
Rights and permissions
About this article
Cite this article
Lee, TK., Bieler, T. . & Kim, CU. Impact of Cooling Rate-Induced Recrystallization on High G Mechanical Shock and Thermal Cycling in Sn-Ag-Cu Solder Interconnects. J. Electron. Mater. 45, 172–181 (2016). https://doi.org/10.1007/s11664-015-4186-6
Received:
Accepted:
Published:
Issue Date:
DOI: https://doi.org/10.1007/s11664-015-4186-6