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Unveiling the Room-Temperature Softening Phenomenon and Texture Evolution in Room-Temperature-Rolled Cu–0.13Sn Alloys

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Abstract

In this investigation, annealed Cu–0.13Sn alloys i.e., as-received samples were subjected to room-temperature rolling (RTR) at reduction ratios (RR) of 40 and 75 pct. Electron backscattered diffraction (EBSD) and transmission electron microscopy (TEM) was used to discuss the microstructure evolution in the as-received and RTR samples. RTR deformation resulted in the formation of Copper-type shear bands (SBs). An unusual phenomenon of static recrystallization (SRX) at room-temperature (RT)/self-annealing was observed in the severely deformed Cu–0.13Sn alloy. SBs and deformed grain boundaries (GBs) were the main sites with high levels of stored energy (SE), and new grains were nucleated in those regions via discontinuous SRX (DSRX) in the RTR samples. Continuous SRX (CSRX) was observed in grains nucleated inside the deformed grains. The fraction of SBs was increased with increases in the RR, and visco-plastic self-consistent (VPSC) modelling was used to predict the texture of the SBs in the severely deformed Cu–0.13Sn alloy. Microstructural heterogeneities had a significant effect on the evolution of the crystallographic texture in as-received and RTR samples. Under low strain (40 pct RR), a Copper-type texture was observed, whereas the severely deformed sample (75 pct RR) showed strong Copper and S components, but weak Brass component. Self-annealed grains in the SB regions and in the deformed GB regions led to the evolution of strong Copper and Rotated Cube components, but weak Brass component.

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Abbreviations

C:

Center region in RD-ND plane

CR:

Cryogenically rolled

CSRX:

Continuous static recrystallization

CT:

Cryogenic temperature

DSRX:

Discontinuous static recrystallization

EBSD:

Electron backscattered diffraction

EDS:

Energy-dispersive spectroscopy

GBs:

Grain boundaries

GOS:

Grain orientation spread

GS:

Grain size

GSAvg :

Average grain size

HR-TEM:

High-resolution transmission electron microscopy

IACS:

International Annealed Copper Standard (IACS)

IQ:

Image quality

IPF:

Inverse pole figure

KAM:

Kernel average misorientation

HAGBs:

High angle grain boundaries (> 15 deg)

LAGBs:

Low angle grain boundaries (3–15 deg)

LAB-I:

Low angle boundaries of type 1 (3–10 deg)

LAB-II:

Low angle boundaries of type 2 (10–15 deg)

ND:

Normal direction

ODF:

Orientation distribution function

Q:

Quarter region in RD-ND plane

RD:

Rolling direction

RR:

Reduction ratio

RT:

Room temperature

RTR:

Room-temperature rolling

RTR40:

Cu–0.13Sn samples rolled to 40 pct thickness reduction

RTR75:

Cu–0.13Sn samples rolled to 75 pct thickness reduction

S:

Surface region in RD-ND plane

SBs:

Shear bands

SE:

Stored energy

SFE:

Stacking fault energy

SLs:

Strain localizations

STEM:

Scanning transmission electron microscopy

ST1-ST4:

Slip traces of {111} plane

SRX:

Static recrystallization

SRV:

Static recovery

SEavg :

Average stored energy

TMP:

Thermomechanical processing

TD:

Transverse direction

VPSC:

Visco-plastic self-consistent

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Acknowledgments

This research was supported by the National Center for Materials Research Data (NCMRD) through the National Research Foundation of Korea (NRF) funded by the Ministry of Science and ICT (NRF-2021M3A7C2089777).

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Authors and Affiliations

  1. Department of Advanced Components and Materials Engineering, Sunchon National University, Suncheon, 57922, Republic of Korea

    Aman Gupta, Lalit Kaushik, Tae-Hyeon Yoo & Shi-Hoon Choi

  2. Department of Metallurgical and Materials Engineering, Indian Institute of Technology Jodhpur (IITJ), Karwar, Jodhpur, Rajasthan, 342037, India

    Lalit Kaushik

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Gupta, A., Kaushik, L., Yoo, TH. et al. Unveiling the Room-Temperature Softening Phenomenon and Texture Evolution in Room-Temperature-Rolled Cu–0.13Sn Alloys. Metall Mater Trans A 55, 1516–1538 (2024). https://doi.org/10.1007/s11661-024-07341-8

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