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Significantly enhanced ductility of Sn–57Bi–1Ag alloy induced by microstructure modulation from in addition

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Abstract

Aiming to solve the intrinsic brittleness of Sn–Bi solder alloy, the effects of In element on the microstructure evolution, mechanical and soldering properties were systematically investigated in Sn–57Bi–1Ag-based alloy. It was found that the addition of In could fragment the reticular Bi-rich phase and increase the content of β-Sn phase in the Sn–(57 − x)Bi–1Ag–xIn alloy, which significantly improved the fracture elongation of the In-containing solder alloy. The elongation of Sn–56.0Bi–1Ag–1.0In reached 68.51%, which was 2.3 times that of Sn–57Bi–1Ag (~ 29.68%). What’s more, the fracture mechanism of the alloy changes from brittle fracture to mixed ductile-brittle fracture with the addition of In element, implying a significant progress in solving the brittleness problem of Sn–Bi solder alloy. Meanwhile, compared to Sn–57Bi–1Ag, the lower melting point and solidification temperature of the In-containing solder alloys improved the solderability, which enhances the spreading rate of alloy and results in a maximum spreading rate of 72.00% for the Sn–56.0Bi–1Ag–1.0In. This work provides a valuable guidance for industrial production of solder alloys as it simultaneously improved both the solderability and the ductility of Sn–Bi-based alloys.

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Funding

The authors would like to thank the financial supports of the Science and Technology Major Project of Yunnan Province (Grant No. 2019ZE001-3, 202202AB080001), the National Natural Science Foundation of China (Grant No. 52061021), and the Young and middle–aged academic and technical leaders reserve talent project of Yunnan Province (Grant No. 202005AC160039).

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Authors and Affiliations

  1. Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming, 650093, China

    K. X. Xiao, C. J. Li, P. Gao & J. H. Yi

  2. Yunnan Engineering Research Center of Metallic Powder Materials, Kunming University of Science and Technology, Kunming, 650093, China

    K. X. Xiao, C. J. Li, P. Gao & J. H. Yi

  3. Yunnan Tin New Material Co. LTD of Yunnan Tin Group (Holding) Co., Ltd, Kunming, 650501, China

    J. H. Qin, S. X. Guo, L. Y. Zhao, J. T. Zhang & Q. He

  4. Yunnan Tin Group (Holding) Co., Ltd, Kunming, 650106, China

    J. B. Peng

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  1. K. X. Xiao
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Contributions

KX: Data curation, Writing—original draft. CL: Writing—review & editing. PG: Methodology. JQ: Resources. SG: Conceptualization. LZ: Investigation. JZ: Supervision. QH: Visualization. JP: Validation. JY: Project administration.

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Correspondence to C. J. Li or J. B. Peng.

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Xiao, K.X., Li, C.J., Gao, P. et al. Significantly enhanced ductility of Sn–57Bi–1Ag alloy induced by microstructure modulation from in addition. J Mater Sci: Mater Electron 34, 1551 (2023). https://doi.org/10.1007/s10854-023-10946-1

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