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In or Ni addition on mechanical properties and interfacial growth in Sn–35Bi–1Ag solder joint during isothermal aging

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Abstract

In this work, the effects of adding 0.5 wt% Ni or 1.0 wt% In on the microstructure, interfacial growth behavior, and mechanical properties of Sn–35Bi–1Ag solder joints during reflowing and isothermal aging at 120 °C were investigated by scanning electron microscopy and ball shear test. During soldering, In addition did not enroll in the reaction between solder and Cu and increased the shear force of as-soldered joints. The interfacial intermetallic compound (IMC) grew with a rod shape. However, Ni atoms would enter into the IMC to produce (Cu, Ni)6Sn5 at the interface, changed the IMC shape, and decreased the shear force of solder joints. During isothermal aging at 120 °C, the addition of 0.5 wt% Ni or 1 wt% In had an acceleration on the growth of interfacial IMC, but the growth rate with the addition of Ni was nearly twice faster than that with In addition. Meanwhile, In addition enhanced the ductility of solder joints with the fracture mode changing to ductile modes, while Ni addition led to the loss of ductility of solder joints with the fracture mode changing to brittle modes.

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Data availability

The data and materials that support the findings of this study are available from the corresponding author upon reasonable request.

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Funding

This research was funded by the National Natural Science Foundation of China, grant No. 51875269, and by Qing Lan Project from Jiangsu Province.

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Authors and Affiliations

  1. School of Materials Science and Engineering, Jiangsu University of Science and Technology, Zhenjiang, 212003, People’s Republic of China

    Jiawei Chen, Mingqing Liao & Fengjiang Wang

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  1. Jiawei Chen
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  2. Mingqing Liao
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  3. Fengjiang Wang
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Contributions

JC methodology, formal analysis, data curation, and writing. ML methodology, formal analysis, and data curation. FW conceptualization, methodology, and writing—review and editing.

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Correspondence to Fengjiang Wang.

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Chen, J., Liao, M. & Wang, F. In or Ni addition on mechanical properties and interfacial growth in Sn–35Bi–1Ag solder joint during isothermal aging. J Mater Sci: Mater Electron 34, 1558 (2023). https://doi.org/10.1007/s10854-023-10971-0

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